Apparatus for fingerprint analysis using current detection

• US 20040190761A1
• Filed: 03/04/2004
• Published: 09/30/2004
• Est. Priority Date: 03/05/2003
• Status: Abandoned Application

• Current Assignee: Sun Moon University
• Original Assignee: Sun Moon University
• Inventors: Lee, Ju-Hyeon
• Application Number:
  US10/793,645
• Publication Number:
  US 20040190761A1
• Time in Patent Office: Days
• US Class Current: 382/124
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing

Abstract

Disclosed herein is an apparatus for fingerprint recognition. The present invention provides a fingerprint recognition sensor (24). The fingerprint recognition sensor (24) includes a substrate (2), a first electrode layer (4), a semi-insulating layer (6), a second electrode layer (8) and a surface layer (10). The first electrode layer (4) is stacked on the substrate (2) and comprised of a plurality of electrodes to allow a current to flow therethrough. The semi-insulating layer (6) is stacked on the first electrode layer (4) with a certain thickness. The second electrode layer (8) is stacked on the semi-insulating layer (6) and comprised of a plurality of electrodes intersecting the electrodes of the first electrode layer (4) to form a matrix while being spaced apart from each other. The surface layer (10) is stacked on the second electrode layer (8) with a certain thickness.

The present invention is advantageous in that it does not require a lens and an image sensor required for conventional optics-type or contact light emitting element-type fingerprint recognition schemes. It is also effective since it does not cause the problems of static electricity and mechanical impacts, which may occur in conventional semiconductor-type fingerprint recognition schemes.

Claims

1. A fingerprint recognition sensor, comprising:

a substrate;

a first electrode layer stacked on the substrate and comprised of a plurality of electrodes to allow a current to flow therethrough;

a semi-insulating layer stacked on the first electrode layer to have a certain thickness;

a second electrode layer stacked on the semi-insulating layer and comprised of a plurality of electrodes intersecting the electrodes of the first electrode layer to form a matrix while being spaced apart from each other; and

a surface layer stacked on the second electrode layer with a certain thickness.

2. The fingerprint recognition sensor according to claim 1, wherein the semi-insulating layer is made of a mixture of insulating powder with a polymer binder.

3. The fingerprint recognition sensor according to claim 2, further comprising an electrode ring formed on a portion of a top of the surface layer to come into contact with a target to be recognized.

4. The fingerprint recognition sensor according to claim 1, further comprising an electrode ring formed on a portion of a top of the surface layer to come into contact with a target to be recognized.

5. An apparatus for recognizing a fingerprint, comprising:

(a) the fingerprint recognition sensor having;

a substrate;

a first electrode layer stacked on the substrate and comprised of a plurality of electrodes to allow a current to flow therethrough;

a semi-insulating layer stacked on the first electrode layer to have a certain thickness;

a second electrode layer stacked on the semi-insulating layer and comprised of a plurality of electrodes intersecting the electrodes of the first electrode layer to form a matrix while being spaced apart from each other; and

a surface layer stacked on the second electrode layer with a certain thickness;

(b) a power supply unit connected to the electrodes of the first and second electrode layers of the fingerprint recognition sensor to supply a current thereto;

(c) at least one detecting unit connected to the electrodes of the first and second electrode layers to measure signals output from the electrodes of the first and second electrode layers; and

(d) an image reproducing unit connected to the detecting unit to analyze signal information output from the detecting unit and then reproduce the recognized target in the form of an image.

6. An apparatus for fingerprint recognition according to claim 5 wherein the semi-insulating layer is made of a mixture of insulating powder with a polymer binder.

7. An apparatus for fingerprint recognition according to claim 6 further comprising an electrode ring formed on a portion of a top of the surface layer to come into contact with a target to be recognized.

8. An apparatus for fingerprint recognition according to claim 5 further comprising an electrode ring formed on a portion of a top of the surface layer to come into contact with a target to be recognized.

9. An apparatus for fingerprint recognition, comprising:

(a) the fingerprint recognition sensor having;

a substrate;

a first electrode layer stacked on the substrate and comprised of a plurality of electrodes to allow a current to flow therethrough;

a semi-insulating layer stacked on the first electrode layer to have a certain thickness;

a second electrode layer stacked on the semi-insulating layer and comprised of a plurality of electrodes intersecting the electrodes of the first electrode layer to form a matrix while being spaced apart from each other;

a surface layer stacked on the second electrode layer with a certain thickness; and

an electrode ring formed on a portion of a top of the surface layer to come into contact with a target to be recognized;

(b) a power supply unit connected to both the electrode ring and the electrodes of the first electrode layer of the fingerprint recognition sensor to supply a current thereto;

(c) at least one detecting unit connected to the electrodes of the first and second electrode layers to measure output signals from the electrodes of the first and second electrode layers; and

(d) an image reproducing unit connected to the detecting unit to analyze signal information output from the detecting unit and then reproduce the recognized target in the form of an image.

10. An apparatus for fingerprint recognition according to claim 9 wherein the semi-insulating layer is made of a mixture of insulating powder with a polymer binder.