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Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies

  • US 20040192177A1
  • Filed: 03/29/2004
  • Published: 09/30/2004
  • Est. Priority Date: 09/01/1998
  • Status: Active Grant
First Claim
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1. A planarizing machine for processing microelectronic substrate assemblies, comprising:

  • a table;

    a fluid container on the table;

    an elastic membrane over the fluid container, the membrane having a first surface engaging a portion of the fluid container to define a fluid chamber between an interior portion of the first surface of the membrane and the fluid container and a second surface facing away from the fluid chamber, and the membrane being coupled to the fluid container to flex the first and second surfaces toward the fluid chamber; and

    a planarizing medium having a planarizing surface facing away from the elastic membrane and an under surface coupled to the second surface of the membrane, the planarizing medium and the membrane being sufficiently flexible to flex the planarizing and under surfaces of the planarizing medium toward the fluid chamber in a local area under a microelectronic substrate pressed against the planarizing medium to provide at least a substantially uniform pressure between the substrate and the planarizing surface across the substrate.

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