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Semiconductor pressure sensor

  • US 20040194550A1
  • Filed: 04/01/2004
  • Published: 10/07/2004
  • Est. Priority Date: 04/03/2003
  • Status: Active Grant
First Claim
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1. A pressure sensor comprising:

  • a sensor IC having a pressure sensor element covered with mold resin, the mold resin being provided with a pressure introduction hole extending outward from the pressure sensor element so as to open to an outer surface thereof;

    a board on which the sensor IC is mounted;

    a case in which the sensor IC and the board are accommodated, the case being provided with a pressure introduction inlet penetrating a wall thereof; and

    an interposed member having a communication hole, the interposed member being disposed between an inner wall of the case and the outer surface of the mold resin so as to allow the pressure introduction inlet to communicate with the pressure introduction hole without air leakage.

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