Tamper-responding encapsulated enclosure having flexible protective mesh structure
First Claim
1. A tamper respondent electronic circuit article comprising:
- a layer of flexible dielectric having a first side and a second side;
a screen-printed pattern of flexible electrically conductive first circuit lines forming a, first resistor network on said first side; and
a photolithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on said second side.
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Accused Products
Abstract
A structure and method for forming a tamper respondent electronic circuit enclosure that includes an integrated circuit structure, a mesh structure surrounding the integrated circuit structure, and a sealed enclosure surrounding the mesh structure. The mesh structure includes a layer of flexible dielectric having a first side and a second side, a screen-printed pattern of flexible electrically conductive first circuit lines forming a first resistor network on the first side, and a photo lithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on the second side.
20 Citations
20 Claims
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1. A tamper respondent electronic circuit article comprising:
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a layer of flexible dielectric having a first side and a second side;
a screen-printed pattern of flexible electrically conductive first circuit lines forming a, first resistor network on said first side; and
a photolithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on said second side. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A tamper respondent electronic circuit enclosure comprising:
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an integrated circuit structure;
a mesh structure surrounding said integrated circuit structure; and
a sealed enclosure surrounding said mesh structure, wherein said mesh structure comprises;
a layer of flexible dielectric having a first side and a second side;
a screen-printed pattern of flexible electrically conductive first circuit lines forming a first resistor network on said first side; and
a photolithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on said second side. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method of manufacturing a tamper respondent electronic circuit article comprising:
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screen printing a pattern of flexible electrically conductive first circuit lines forming a first resistor network on a first side of a flexible dielectric; and
photolithographically forming a pattern of flexible electrically conductive second circuit lines forming a second resistor network on a second side of said flexible dielectric. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification