×

Tamper-responding encapsulated enclosure having flexible protective mesh structure

  • US 20040195001A1
  • Filed: 11/07/2003
  • Published: 10/07/2004
  • Est. Priority Date: 01/03/2001
  • Status: Active Grant
First Claim
Patent Images

1. A tamper respondent electronic circuit article comprising:

  • a layer of flexible dielectric having a first side and a second side;

    a screen-printed pattern of flexible electrically conductive first circuit lines forming a, first resistor network on said first side; and

    a photolithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on said second side.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×