Method for protecting encapsulated sensor structures using stack packaging
First Claim
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1. A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, comprising:
- fabricating the micro-mechanical sensor structure with a protective membrane;
arranging the micro-mechanical sensor chip so that a surface of the protective membrane faces toward a second chip; and
securing the micro-mechanical sensor chip to the second chip.
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Abstract
A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, in which the micro-mechanical sensor structure is fabricated with a protective membrane, the micro-mechanical sensor chip is arranged so that a surface of the protective membrane faces toward a second chip, and the micro-mechanical sensor chip is secured to the second chip.
28 Citations
39 Claims
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1. A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, comprising:
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fabricating the micro-mechanical sensor structure with a protective membrane;
arranging the micro-mechanical sensor chip so that a surface of the protective membrane faces toward a second chip; and
securing the micro-mechanical sensor chip to the second chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A micro-mechanical sensor device, comprising:
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a first chip; and
a micro-mechanical sensor chip having an embedded micro-mechanical sensor structure and a protective membrane arranged on the embedded micro-mechanical sensor structure, wherein the micro-mechanical sensor chip is arranged onto the first chip so that the protective membrane faces toward the first chip. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
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39. A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, comprising:
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fabricating the micro-mechanical sensor structure with a sealing bond to surround the micro-mechanical sensor structure;
arranging the micro-mechanical sensor chip so that a surface of the protective membrane faces toward a second chip; and
securing the micro-mechanical sensor chip to the second chip.
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Specification