Micro-scale interconnect device with internal heat spreader and method for fabricating same
First Claim
1. A method for fabricating a micro-scale device having internal heat spreading capability to reduce operating temperature, comprising the steps of forming a plurality of generally coplanar arrays of electrical transmission lines in a heterostructure, and embedding a thermally conductive element in one or more dielectric layers at a location of the heterostructure where a heat transfer path can be established in response to a thermal gradient generally directed from at least one of the arrays to the thermally conductive layer.
3 Assignments
0 Petitions
Accused Products
Abstract
A micro-scale interconnect device with internal heat spreader and method for fabricating same. The device includes first and second arrays of generally coplanar electrical communication lines. The first array is disposed generally along a first plane, and the second array is disposed generally along a second plane spaced from the first plane. The arrays are electrically isolated from each other. Embedded within the interconnect device is a heat spreader element. The heat spreader element comprises a dielectric material disposed in thermal contact with at least one of the arrays, and a layer of thermally conductive material embedded in the dielectric material. The device is fabricated by forming layers of electrically conductive, dielectric, and thermally conductive materials on a substrate. The layers are arranged to enable heat energy given off by current-carrying communication lines to be transferred away from the communication lines.
-
Citations
11 Claims
- 1. A method for fabricating a micro-scale device having internal heat spreading capability to reduce operating temperature, comprising the steps of forming a plurality of generally coplanar arrays of electrical transmission lines in a heterostructure, and embedding a thermally conductive element in one or more dielectric layers at a location of the heterostructure where a heat transfer path can be established in response to a thermal gradient generally directed from at least one of the arrays to the thermally conductive layer.
-
9. A method for fabricating a micro-scale device having internal heat spreading capability to reduce operating temperature, comprising the steps of:
-
(a) forming a first array of conductive elements on a substrate;
(b) depositing a first dielectric layer on the first array;
(c) depositing a layer of thermally conductive material on the first dielectric layer;
(d) depositing a second dielectric layer on the layer of thermally conductive material; and
(e) forming a second array of conductive elements on the second dielectric layer. - View Dependent Claims (10)
-
-
11. A method for conducting current in a micro-scale interconnect device at a reduced device operating temperature, comprising the steps of:
-
(a) conducting current in a micro-scale interconnect device comprising a first array of generally coplanar electrical communication lines disposed generally along a first plane, and a second array of generally coplanar electrical communication lines disposed generally along a second plane spaced from the first plane and electrically isolated from the first array, wherein the current is conducted through at least one of the communication lines of the arrays; and
(b) causing heat energy given off by the at least one current-conducting communication line to be transferred away from the arrays by providing a heat spreader element integrated with the interconnect device, the heat spreader element comprising a dielectric material disposed in thermal contact with at least one of the arrays, and a layer of thermally conductive material embedded in the dielectric material, whereby the heat energy is directed toward the heat spreader element in response to a thermal gradient created between the at least one current-conducting communication line and the heat spreader element.
-
Specification