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Micro-scale interconnect device with internal heat spreader and method for fabricating same

  • US 20040197960A1
  • Filed: 04/22/2004
  • Published: 10/07/2004
  • Est. Priority Date: 11/09/2001
  • Status: Abandoned Application
First Claim
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1. A method for fabricating a micro-scale device having internal heat spreading capability to reduce operating temperature, comprising the steps of forming a plurality of generally coplanar arrays of electrical transmission lines in a heterostructure, and embedding a thermally conductive element in one or more dielectric layers at a location of the heterostructure where a heat transfer path can be established in response to a thermal gradient generally directed from at least one of the arrays to the thermally conductive layer.

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