Pad conditioner of CMP equipment
First Claim
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1. A pad conditioner of planarization equipment for conditioning a surface of a polishing pad, comprising:
- a disk holder that supports a polishing disk; and
a conditioner head to which said disk holder is mounted so as to be rotatable and linearly movable up and down, said conditioner head having a rotary driving device operatively connected to said disk holder so as to rotate said disk holder about an axis of rotation, and linear driving device operative to move the disk holder between an upper position and a lower position, said linear driving device including a first magnet and a second magnet, said first magnet being connected to said disk holder, and said second magnetic being connected to said conditioner head opposite the first magnet, whereby the disk holder can be moved relative to the conditioner head by a magnetic force between the first and second magnets.
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Abstract
A pad conditioner of wafer planarization equipment includes a linear driving device for moving a disk holder up and down using a magnetic force. The linear driving device has an electromagnet, a permanent magnet, and a controller. The controller controls the power supplied to the electromagnet such that the electromagnet and permanent magnet produce a force of attraction and/or repulsion used to move the disk holder relative to a polishing pad of the wafer planarization equipment.
31 Citations
12 Claims
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1. A pad conditioner of planarization equipment for conditioning a surface of a polishing pad, comprising:
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a disk holder that supports a polishing disk; and
a conditioner head to which said disk holder is mounted so as to be rotatable and linearly movable up and down, said conditioner head having a rotary driving device operatively connected to said disk holder so as to rotate said disk holder about an axis of rotation, and linear driving device operative to move the disk holder between an upper position and a lower position, said linear driving device including a first magnet and a second magnet, said first magnet being connected to said disk holder, and said second magnetic being connected to said conditioner head opposite the first magnet, whereby the disk holder can be moved relative to the conditioner head by a magnetic force between the first and second magnets. - View Dependent Claims (2, 3, 4, 5, 6)
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7. Chemical mechanical polishing equipment for use in polishing a substrate, said equipment comprising:
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a polishing station including a polishing pad, a rotatable table supporting said polishing pad, and a pad conditioner for use in conditioning an upper surface of the polishing pad, said pad conditioner comprising a disk holder that supports a polishing disk, and a conditioner head to which said disk holder is mounted so as to be rotatable and linearly movable up and down, said conditioner head having a rotary driving device operatively connected to said disk holder so as to rotate said disk holder about an axis of rotation, and linear driving device operative to move the disk holder between an upper position and a lower position, said linear driving device including a first magnet and a second magnet, said first magnet being connected to said disk holder, and said second magnetic being connected to said conditioner head opposite the first magnet, whereby the disk holder can be moved relative to the conditioner head by a magnetic force between the first and second magnets; and
a polishing head assembly disposed above said polishing station, said polishing head assembly including a polishing head that holds a substrate against the polishing pad. - View Dependent Claims (8, 9, 10, 11, 12)
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Specification