Conductive pattern and method of making

• US 20040200061A1
• Filed: 04/11/2003
• Published: 10/14/2004
• Est. Priority Date: 04/11/2003
• Status: Abandoned Application

• Current Assignee: Avery Dennison Corporation
• Original Assignee: Avery Dennison Corporation
• Inventors: Forster, Ian J., Ferguson, Scott Wayne, Coleman, James P., Grunlan, Jaime C., Holman, Andrew W., Liu, Peikang
• Application Number:
  US10/412,794
• Publication Number:
  US 20040200061A1
• Time in Patent Office: Days
• US Class Current: 29/825
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/0347 Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias reinforcing the conductive pattern H05K3/24
• CPC Class Codes: H05K 2203/1469 Circuit made after mounting or encapsulation of the components
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/205 using a pattern electroplated or electroformed on a metallic carrier
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10T 156/1062 Prior to assembly
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

Claims

1. A method of making a conductive pattern, the method comprising:

plating the conductive pattern atop a conductive substrate; and

separating the conductive pattern from the conductive substrate.

2. The method of claim 1, wherein the separating includes:

coupling the conductive pattern to a separation substrate; and

separating the separation substrate and the conductive substrate.

3. The method of claim 2, wherein the coupling includes adhesively joining the conductive pattern and the separation substrate.

4. The method of claim 3,

wherein the separation substrate is coated with an adhesive;

and

wherein the adhesively joining includes;

bringing the separation substrate and the conductive pattern together; and

activating the adhesive.

5. The method of claim 4,

wherein the adhesive is a pressure-sensitive adhesive, and

wherein the activating includes pressing the separation substrate and the conductive pattern together.

6. The method of claim 4,

wherein the adhesive is a heat-activated adhesive, and

wherein the activating includes heating at least one of the separation substrate and the conductive pattern.

7. The method of claim 3,

further comprising, after the plating, depositing an adhesive over at least part of the conductive pattern;

and

wherein the adhesively joining includes;

bringing the separation substrate and the conductive pattern together; and

activating the adhesive.

8. The method of claim 7,

wherein the adhesive is a pressure-sensitive adhesive, and

wherein the activating includes pressing the separation substrate and the conductive pattern together.

9. The method of claim 7,

wherein the adhesive is a heat-activated adhesive, and

wherein the activating includes heating at least one of the separation substrate and the conductive pattern.

10. The method of claim 1, wherein the separating includes magnetically separating the conductive pattern from the conductive substrate.

11. The method of claim 1, wherein the separating includes resonating the conductive substrate with ultrasonic forces.

12. The method of claim 1, further comprising, prior to the plating, depositing a conductive ink layer on the conductive substrate.

13. The method of claim 12,

wherein the depositing the conductive ink layer includes depositing a patterned conductive ink layer on the conductive substrate;

wherein the patterned conductive ink layer corresponds in configuration to the conductive pattern.

14. The method of claim 13, wherein the depositing includes printing the patterned conductive ink layer on the conductive substrate.

15. The method of claim 14, wherein the printing includes printing a conductive ink using a printing method selected from a group consisting of screen printing, flexo printing, gravure printing, and inkjet printing.

16. The method of claim 13, further comprising, prior to the depositing, placing a dielectric layer on the conductive substrate, wherein the dielectric layer has openings therein to allow formation of the patterned conductive ink layer.

17. The method of claim 16, wherein the placing the dielectric layer includes attaching the dielectric layer to the conductive substrate.

18. The method of claim 12, further comprising, prior to the depositing, placing a dielectric layer on the conductive substrate, wherein the dielectric layer has openings therein to allow plating therethrough of an exposed portion of the conductive ink layer.

19. The method of claim 12, wherein the depositing includes depositing a conductive ink containing carbon particles.

20. The method of claim 12, wherein the depositing includes depositing a conductive ink containing a metal particles.

21. The method of claim 12, wherein the depositing includes depositing a conductive ink containing an intrinsically conductive polymer.

22. The method of claim 21, wherein the conductive polymer includes a material selected from the group consisting of polyethylenedioxythiophene (PEDOT), polypyrole (PPy), and polyaniline (PANI).

23. The method of claim 12, wherein the separating includes heating the conductive ink layer prior to releasing the conductive pattern from the conductive substrate.

24. The method of claim 23, wherein the heating the conductive ink layer includes melting at least part of the conductive ink layer.

25. The method of claim 23, wherein the depositing the conductive ink layer includes depositing a conductive ink that contains wax.

26. The method of claim 1, wherein the plating includes electroplating.

27. The method of claim 26,

further comprising, prior to the plating, depositing a patterned conductive ink layer on the conductive substrate;

wherein the patterned conductive ink layer corresponds in configuration to the conductive pattern.

28. The method of claim 27, wherein the depositing includes depositing a conductive ink containing carbon particles.

29. The method of claim 27, wherein the depositing includes depositing a conductive ink containing an intrinsically conductive polymer.

30. The method of claim 29, wherein the conductive polymer includes a material selected from the group consisting of polyethylenedioxythiophene (PEDOT), polypyrrole (PPy), and polyaniline (PANI).

31. The method of claim 27, wherein the electroplating includes preferentially plating the patterned conductive ink layer relative to the uncovered parts of the conductive substrate.

32. The method of claim 1, wherein the plating includes forming conductive links electrically connecting the conductive pattern to an electrical component.

33. The method of claim 32, wherein the separating includes separating the electrical component along with the conductive pattern.

34. The method of claim 33, further comprising:

prior to the plating, depositing a patterned conductive ink layer on the conductive substrate, wherein the patterned conductive ink layer corresponds in configuration to the conductive pattern; and

prior to the plating, placing the electrical component atop the conductive substrate.

35. The method of claim 34, wherein the placing occurs before the depositing the patterned conductive ink layer.

36. The method of claim 35, wherein the depositing the conductive ink layer includes at least partially overlapping the electrical component with conductive ink.

37. The method of claim 34, wherein the placing includes placing the electrical component into contact with the patterned conductive ink layer.

38. The method of claim 37, wherein the placing includes adhesively attaching the electrical component to the patterned conductive ink layer.

39. The method of claim 37, wherein the placing includes placing the electrical component into contact with the patterned conductive ink layer prior to completion of drying of the patterned conductive ink layer.

40. The method of claim 32,

wherein the conductive pattern includes an antenna for a radio frequency identification (RFID) device;

and

wherein the electrical component includes an RFID chip.

41. The method of claim 40, wherein the electrical component also includes an energy storage device.

42. The method of claim 41, wherein the energy storage device includes a battery.

43. The method of claim 41, wherein the electrical component also includes a resonator.

44. The method of claim 40, wherein the electrical component is an RFID strap that includes the RFID chip.

45. The method of claim 44,

wherein the forming conductive links includes forming the links between the antenna and conductive leads of the strap;

and

wherein the leads are electrically connected to the chip.

46. The method of claim 1, wherein the conductive pattern is at least part of an RFID antenna.

47. The method of claim 46, wherein the separating includes attaching the conduction pattern to a separation substrate that is a substrate of an RFID device.

48. The method of claim 1, wherein at least some of the making includes at least one roll-to-roll process.

49. The method of claim 1, wherein the conductive substrate is a metal foil substrate.

50. The method of claim 49, wherein the metal foil substrate is an aluminum foil substrate.

51. The method of claim 1, wherein the plating includes electroplating copper.

52. The method of claim 1, wherein the conductive pattern is a decorative metal pattern.

53. A method of making a radio frequency identification (RFID) device, comprising:

plating a conductive pattern atop a conductive substrate, wherein the conductive pattern includes an RFID antenna;

coupling the RFID antenna to a separation substrate; and

separating the separation substrate and the conductive substrate, thereby separating the RFID antenna from the conductive substrate.

54. The method of claim 53,

wherein the separation substrate is an RFID substrate of the RFID device;

and

wherein the coupling includes attaching the RFID antenna to the RFID substrate.

55. The method of claim 54, the attaching includes adhesively attaching the RFID antenna to the RFID substrate.

56. The method of claim 55, wherein the RFID substrate includes paper.

57. The method of claim 55, wherein the RFID substrate includes plastic.

58. The method of claim 53, further comprising coupling an RFID chip to the antenna.

59. The method of claim 58, wherein the electrical component also includes an energy storage device.

60. The method of claim 59, wherein the energy storage device includes a battery.

61. The method of claim 59, wherein the electrical component also includes a resonator.

62. The method of claim 58, wherein the RFID chip is part of an RFID strap that includes conductive leads coupled to the RFID chip.

63. The method of claim 58, wherein the coupling the RFID chip to the antenna includes placing the RFID chip atop the conductive substrate before the plating.

64. The method of claim 63, wherein the plating includes forming conductive links between the antenna and the RFID chip.

65. The method of claim 58, wherein the coupling the RFID chip to the antenna occurs after the plating and before the separating.

66. The method of claim 65, wherein the coupling includes welding the RFID chip to the antenna.

67. The method of claim 58, wherein the coupling the RFID chip to the antenna occurs after the plating and after the separating.

68. The method of claim 53, further comprising, prior to the plating, depositing a conductive ink layer on the conductive substrate.

69. The method of claim 68,

wherein the depositing the conductive ink layer includes depositing a patterned conductive ink layer on the conductive substrate;

wherein the patterned conductive ink layer corresponds in configuration to the conductive pattern.

70. The method of claim 69, wherein the depositing includes printing the patterned conductive ink layer on the conductive substrate.

71. The method of claim 69, further comprising, prior to the depositing, placing a dielectric layer on the conductive substrate, wherein the dielectric layer has openings therein to allow formation of the patterned conductive ink layer.

72. The method of claim 69, wherein the depositing includes depositing a conductive ink containing carbon particles.

73. The method of claim 69, wherein the depositing includes depositing a conductive ink containing an intrinsically conductive polymer.

74. The method of claim 73, wherein the conductive polymer includes a material selected from the group consisting of polyethylenedioxythiophene (PEDOT), polypyrrole (PPy), and polyaniline (PANI).

75. The method of claim 53, wherein the plating includes electroplating.

76. The method of claim 75,

further comprising, prior to the plating, depositing a patterned conductive ink layer on the conductive substrate;

wherein the patterned conductive ink layer corresponds in configuration to the conductive pattern.

77. The method of claim 76, wherein the depositing includes depositing a conductive ink containing carbon particles.

78. The method of claim 76, wherein the depositing includes depositing a conductive ink containing an intrinsically conductive polymer.

79. The method of claim 78, wherein the conductive polymer includes a material selected from the group consisting of polyethylenedioxythiophene (PEDOT), polypyrrole (PPy), and polyaniline (PANI).

80. The method of claim 76, wherein the electroplating includes preferentially plating the patterned conductive ink layer relative to the uncovered parts of the conductive substrate.

81. A radio frequency identification (RFID) device comprising:

an RFID chip;

an RFID antenna; and

electroplated conductive links providing electrical coupling between the chip and the antenna.

82. The device of claim 81, wherein the antenna includes electroplated material that is substantially continuous with the conductive links.

83. The device of claim 81,

wherein the chip is part of an RFID strap which includes conductive leads coupled to the chip;

and

wherein the conductive links are in contact with the conductive leads.

84. The device of claim 81, wherein the antenna and the conductive links include copper.

85. The device of claim 81, wherein the antenna includes carbon.

86. The device of claim 85, wherein the carbon is at least part of a carbon-containing ink.

87. The device of claim 81, further comprising an energy storage device electrically coupled to the chip.

88. The device of claim 87, wherein the energy storage device includes a battery.

89. The device of claim 87, further comprising a resonator electrically connected to the chip.

90. The device of claim 87, wherein the antenna includes electroplated material that is substantially continuous with the conductive links.

91. The device of claim 90,wherein the electroplated material includes connections with the energy storage device.

92. A method of producing an RFID device, comprising:

depositing a patterned conductive ink layer on a substrate;

placing an electrical component in contact with the conductive ink layer; and

electroplating to form a conductive pattern electrically coupled to the electrical component.

93. The method of claim 92, wherein the substrate is a conductive substrate.

94. The method of claim 92, wherein the substrate is a non-conductive substrate.

95. The method of claim 92, wherein the electrical component includes an RFID chip.

96. The method of claim 95, wherein the RFID chip is part of an RFID strap that includes conductive leads coupled to the chip.

97. The method of claim 95, wherein the electrical component also includes an energy storage device.

98. The method of claim 97, wherein the energy storage device includes a battery.

99. The method of claim 98, further comprising, after the electroplating, activating the battery.

100. The method of claim 97, wherein the electrical component also includes a resonator.

101. A method of making a conductive pattern, the method comprising:

placing a dielectric layer on a conductive substrate, wherein the dielectric layer has openings therethrough;

plating the conductive pattern atop the conductive substrate, through the openings; and

separating the conductive pattern from the conductive substrate.

102. The method of claim 101, wherein the placing the dielectric layer includes attaching the dielectric layer to the conductive substrate.

103. The method of claim 101, wherein the plating includes plating directly onto the conductive substrate.

104. The method of claim 101, further comprising, prior to the plating, roughening at least part of the conductive substrate.

105. The method of claim 101,

further comprising, prior to the plating, depositing a conductive ink layer onto the conductive substrate, through the openings;

wherein the plating includes plating onto the conductive ink layer.