BONDING OF LIGHT EMITTING DIODES HAVING SHAPED SUBSTRATES
First Claim
1. A method of themosonically bonding a light emitting diode to a submount, comprising:
- applying force to a surface of a substrate of the light emitting diode that is oblique to a direction of motion of the light emitting diode to thermosonically bond the light emitting diode to the submount.
7 Assignments
0 Petitions
Accused Products
Abstract
Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do not exceed a failure threshold of the substrate. Bonding a light emitting diode to a submount may be provided by applying force to a surface of a substrate of the light emitting diode that is oblique to a direction of motion of the light emitting diode to thermosonically bond the light emitting diode to the submount. Collets for use in bonding shaped substrates to a submount and systems for bonding shaped substrates to a submount are also provided.
59 Citations
9 Claims
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1. A method of themosonically bonding a light emitting diode to a submount, comprising:
applying force to a surface of a substrate of the light emitting diode that is oblique to a direction of motion of the light emitting diode to thermosonically bond the light emitting diode to the submount. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9-67. -67. (Canceled)
Specification