Forming method of magnetic body, magnetic body, and printed circuit board
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Accused Products
Abstract
A method of forming a magnetic body, alternative to a ferrite core, on a printed circuit board is provided. A printed circuit board is set in a mold and injection molding is conducted. The mold comprises a fixed plate, an intermediate plate and a movable plate. A cavity in the intermediate plate is filled with a melted material (i.e., mixture of resin and magnetic filler) supplied via a sprue and a runner. A cavity in the movable plate is also filled with the material supplied to the cavity in the intermediate plate through a hole in the printed circuit board. When a magnetic body for noise control is directly injection molded onto the printed circuit board in such a way, no gap appears between the magnetic body and the printed circuit board. As a result, the magnetic body functions well as desired.
56 Citations
26 Claims
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1-8. -8. (CANCELED).
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9. A printed circuit board on which a magnetic body is formed by a method of:
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preparing a melted material by mixing and melting at least a magnetic filler and a binder including at least one resin, setting the printed circuit board into a mold, and performing molding to the printed circuit board using the melted material, wherein the magnetic body is formed on at least one side of the printed circuit board, and the magnetic body is formed to cover at least a portion of a circuit pattern on the printed circuit board. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A printed circuit board on which a magnetic body is formed by a method of:
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preparing a melted material by mixing and melting at least a magnetic filler and a binder including at least one resin, setting the printed circuit board into a mold, and performing molding to the printed circuit board using the melted material, wherein the magnetic body is formed on at least one side of the printed circuit board, and the magnetic body is formed to cover at least a portion of an electronic component on the printed circuit board. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26)
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Specification