Enhanced polyisobutylene modified hot melt adhesive formulation

• US 20040204529A1
• Filed: 04/08/2003
• Published: 10/14/2004
• Est. Priority Date: 04/08/2003
• Status: Active Grant

• Current Assignee: TPC Group LLC
• Original Assignee: Texas Petrochemicals LP
• Inventors: Gipson, Betty L.
• Granted Patent: US 6,930,148 B2
• Time in Patent Office: Days
• US Class Current: 524/474
• CPC Class Codes: C08L 21/00 Compositions of unspecified rubbers
• CPC Class Codes: C08L 23/22 Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefins
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C08L 2666/04 Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
• CPC Class Codes: C08L 2666/06 Homopolymers or copolymers of unsaturated hydrocarbons; Derivatives thereof
• CPC Class Codes: C08L 53/02 of vinyl-aromatic monomers and conjugated dienes
• CPC Class Codes: C09J 123/0853 Vinylacetate
• CPC Class Codes: C09J 153/02 Vinyl aromatic monomers and conjugated dienes

Abstract

An improved hot melt adhesive includes a base polymer and a PIB modifier that is made up of a homopolymer of isobutylene wherein a predominant portion of the double bonds are in either an alpha position or a beta position. The modifier may function to improve the loop tack and/or the peel adhesion of the hot melt adhesive.

Claims

1. An improved hot melt adhesive comprising a base polymer and a PIB modifier, said PIB modifier comprising a homopolymer of isobutylene wherein a predominant portion of the double bonds are in either an alpha position or a beta position.

2. An improved hot melt adhesive as set forth in claim 1, wherein said base polymer further comprises a natural rubber, a styrene-butadiene rubber, an ethylene vinyl acetate copolymer, a styrene-isoprene-styrene block copolymer, a styrene-butadiene-styrene block copolymer, or a low density polyethylene.

3. An improved hot melt adhesive as set forth in claim 1, wherein said PIB modifier has a polydispersity no greater than about 2.5.

4. An improved hot melt adhesive as set forth in claim 1, wherein said PIB modifier has a M_N no greater than about 3000.

5. An improved hot melt adhesive as set forth in claim 4, wherein said PIB modifier has a M_N which is at least about 900.

6. An improved hot melt adhesive as set forth in claim 1, wherein at least about 95% of the monomeric units incorporated in the PIB modifier molecules are isobutylene moieties.

7. An improved hot melt adhesive as set forth in claim 1, wherein at least about 97% of the monomeric units incorporated in the PIB modifier molecules are isobutylene moieties.

8. An improved hot melt adhesive as set forth in claim 1, wherein at least about 99% of the monomeric units incorporated in the PIB modifier molecules are isobutylene moieties.

9. An improved hot melt adhesive as set forth in claim 1, wherein no more than about 1% of the monomeric units incorporated in the PIB modifier molecules are something other than isobutylene moieties.

10. An improved hot melt adhesive as set forth in claim 1, wherein at least about 40% of the double bonds of the PIB modifier molecules are in the alpha position.

11. An improved hot melt adhesive as set forth in claim 1, wherein at least about 50% of the double bonds of the PIB modifier molecules are in the alpha position.

12. An improved hot melt adhesive as set forth in claim 1, wherein at least about 60% of the double bonds of the PIB modifier are in the alpha position.

13. An improved hot melt adhesive as set forth in claim 1, wherein at least about 70% of the double bonds of the PIB modifier molecules are in the alpha position.

14. An improved hot melt adhesive as set forth in claim 1, wherein at least about 80% of the double bonds of the PIB modifier molecules are in the alpha position.

15. An improved hot melt adhesive as set forth in claim 1, wherein at least about 90% of the double bonds of the PIB modifier molecules are in the alpha position.

16. An improved hot melt adhesive as set forth in claim 1, wherein more than 90% of the double bonds of the PIP modifier molecules are in the alpha position.

17. An improved hot melt adhesive as set forth in claim 1, 10, 11, 12, 13, 14, 15, or 16, wherein no more than about 1% of the double bonds of the PIB modifier molecules are in a position other than alpha or beta.

34. An improved hot melt adhesive as set forth in claim 1, 2, 3, 6, 7, 9, 10, 11, 12, 13, 14, 15, or 16, wherein said hot melt adhesive comprises from about 5 to about 25% by weight of said PIB modifier.

36. An improved hot melt adhesive as set forth in claim 1, 2, 3, 6, 7, 9, 10, 11, 12, 13, 14, 15, or 16, wherein said hot melt adhesive has improved loop tack properties relative to hot melt adhesives containing conventional polybutene.

37. An improved hot melt adhesive as set forth in claim 1, 2, 3, 6, 7, 9, 10, 11, 12, 13, 14, 15, or 16, wherein said hot melt adhesive has improved peel adhesion properties relative to hot melt adhesives containing conventional polybutene.

38. An improved hot melt adhesive as set forth in claim 1, 2, 3, 6, 7, 9, 10, 11, 12, 13, 14, 15, or 16, wherein said hot melt adhesive has improved peel adhesion properties and improved loop tack properties relative to hot melt adhesives containing conventional polybutene.

18. A method for improving the properties of a hot melt adhesive comprising providing a hot melt adhesive base polymer formulation and including in said base formulation a PIB modifier, said PIB modifier comprising a homopolymer of isobutylene wherein a predominant portion of the double bonds are in either an alpha position or a beta position.

19. A method as set forth in claim 18, wherein said PIB modifier has a polydispersity no greater than about 2.5.

20. A method as set forth in claim 18, wherein said PIB modifier has a M_N no greater than about 3000.

21. A method as set forth in claim 20, wherein said PIB modifier has a M_N which is at least about 900.

22. A method as set forth in claim 18, wherein at least about 92% of the monomeric units incorporated in the PIB modifier molecules are isobutylene moieties.

23. A method as set forth in claim 18, wherein at least about 95% of the monomeric units incorporated in the PIB modifier molecules are isobutylene moieties.

24. A method as set forth in claim 18, wherein at least about 99% of the monomeric units incorporated in the PIB modifier molecules are isobutylene moieties.

25. A method as set forth in claim 18, wherein no more than about 1% of the monomeric units incorporated in the PIB modifier molecules are something other than isobutylene moieties.

26. A method as set forth in claim 18, wherein at least about 40% of the double bonds of the PIB modifier molecules are in the alpha position.

27. A method as set forth in claim 18, wherein at least about 50% of the double bonds of the PIB modifier molecules are in the alpha position.

28. A method as set forth in claim 18, wherein at least about 60% of the double bonds of the PIB modifier molecules are in the alpha position.

29. A method as set forth in claim 18, wherein at least about 70% of the double bonds of the PIB modifier molecules are in the alpha position.

30. A method as set forth in claim 18, wherein at least about 80% of the double bonds of the PIB modifier molecules are in the alpha position.

31. A method as set forth in claim 18, wherein at least about 90% of the double bonds of the PIB modifier molecules are in the alpha position.

32. A method as set forth in claim 18, wherein more than 90% of the double bonds of the PIB modifier molecules are in the alpha position.

33. A method as set forth in claim 18, 26, 27, 28, 29, 30, 31, or 32, wherein no more than about 1% of the double bonds of the PIB modifier molecules are in a position other than the alpha or beta.

35. A method as set forth in claim 18, 19, 20, 23, 24, 27, 28, 29, 30, 31, 32, 33 or 34, wherein from about 5 to about 25% by weight of said PIB modifier is included in said hot melt adhesive.