Semiconductor light-emitting device and method for fabricating the same

• US 20040206969A1
• Filed: 04/08/2004
• Published: 10/21/2004
• Est. Priority Date: 04/15/2003
• Status: Active Grant

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Orita, Kenji
• Granted Patent: US 7,102,175 B2
• Time in Patent Office: Days
• US Class Current: 257/97
• CPC Class Codes: H01L 2933/0083 Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/42 Transparent materials

Abstract

Projections/depressions of a two-dimensional periodic structure are formed in a p-GaN layer (4) such that the period of the projections/depressions is 1 to 20 times the wavelength of light radiated from an active layer (3) in a semiconductor. As a result, a diffractive effect achieved by the projections/depressions of the two-dimensional periodic structure change the direction in which the light radiated from the active layer (3) travels. If the projections/depressions are not provided, light at a radiation angle which satisfies conditions for total reflection at the interface between a semiconductor device and an air cannot be extracted to the outside of the semiconductor device so that the light emission efficiency of the device is low. By contrast, the projections/depressions as formed with a period according to the present invention diffract the light at an angle which does not cause total reflection so that the efficiency with which the light is extracted to the outside of the semiconductor device is improved exponentially. This improves the light emission efficiency of the device.

Claims

1. A semiconductor light-emitting device comprising an element having:

a semiconductor multilayer film containing a nitride and having an active layer; and

a transparent layer provided on the semiconductor multilayer film and having projections/depressions of a two-dimensional periodic structure at an upper surface thereof to diffract light from the active layer at the projections/depressions and guide the diffracted light to an outside of the semiconductor multilayer film.

2. The semiconductor light-emitting device of claim 1, wherein, when a distance between each of depressed portions of the projections/depressions and the active layer is D and a wavelength of the light from the active layer in the element is λ

, D≦

5λ

is satisfied.

3. The semiconductor light-emitting device of claim 1, wherein, when a period of the projections/depressions is L and a wavelength of the light from the active layer in the element is λ

, λ

≦

L≦

20λ

is satisfied.

4. The semiconductor light-emitting device of claim 1, wherein, when a height of each of the projections/depressions is h and a wavelength of the light from the active layer in the element is λ

, h≦

5λ

is satisfied.

5. The semiconductor light-emitting device of claim 1, wherein the transparent layer is a first nitride semiconductor layer and an electrode layer is further provided on the first nitride semiconductor layer.

6. The semiconductor light-emitting device of claim 5, wherein an upper surface of the electrode layer is provided with projections/depressions reflecting the projections/depressions of the upper surface of the first nitride semiconductor layer.

7. The semiconductor light-emitting device of claim 5, wherein the electrode layer is a metal or a metal oxide having a film thickness of 50 nm or less.

8. The semiconductor light-emitting device of claim 5, wherein the electrode layer is an indium tin oxide.

9. The semiconductor light-emitting device of claim 1, wherein

the semiconductor multilayer film further has a nitride semiconductor layer of a first conductivity type provided on the active layer and a nitride semiconductor layer of a second conductivity type provided under the active layer and

the transparent layer has an electrode layer provided on the nitride semiconductor layer of the first conductivity type.

10. The semiconductor light-emitting device of claim 9, wherein an upper surface of the electrode layer is provided with the projections/depressions of a two-dimensional periodic structure.

11. The semiconductor light-emitting device of claim 9, wherein the transparent layer further has a layer provided on the electrode layer and having the projections/depressions of a two-dimensional periodic structure.

12. The semiconductor light-emitting device of claim 9, wherein the electrode layer is a metal or a metal oxide having a film thickness of 50 nm or less.

13. The semiconductor light-emitting device of claim 9, wherein the electrode layer is an indium tin oxide.

14. The semiconductor light-emitting device of claim 11, wherein the layer having the projections/depressions of a two-dimensional periodic structure is made of a resin.

15. The semiconductor light-emitting device of claim 14, wherein the projections/depressions are formed by pressing.

16. The semiconductor light-emitting device of claim 1, wherein each of projecting portions of the projections/depressions of the transparent layer has a flat upper surface.

17. A method for fabricating a semiconductor light-emitting device having a semiconductor multilayer film containing a nitride and having an active layer and a transparent layer provided on the semiconductor multilayer film, the method comprising the steps of:

(a) forming the transparent layer on the semiconductor multilayer film; and

(b) after the step (a), pressing an upper surface of the transparent layer against a mold die having a surface provided with projections/depressions of a two-dimensional periodic structure and thereby forming, at the upper surface of the transparent layer, projections/depressions in inverted relation to the projections/depressions of the mold die.