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Nonvolatile memory cell with a floating gate at least partially located in a trench in a semiconductor substrate

  • US 20040207006A1
  • Filed: 05/17/2004
  • Published: 10/21/2004
  • Est. Priority Date: 09/19/2002
  • Status: Active Grant
First Claim
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1. An integrated circuit comprising a first nonvolatile memory cell, the integrated circuit comprising:

  • a semiconductor substrate having a top surface and a trench formed in the top surface;

    a dielectric on a surface of the trench;

    a conductive floating gate at least partially located in the trench;

    wherein the first nonvolatile memory cell comprises a first field effect transistor (FET) whose conductivity is at least partially controlled by the floating gate, and comprises a second FET for controlling access to the first FET;

    wherein the substrate comprises;

    a first semiconductor region of a first conductivity type adjacent to the trench and providing a first source/drain region for the first FET;

    a second semiconductor region of a second conductivity type adjacent to the trench above the first semiconductor region and providing a channel region for the first FET;

    a third semiconductor region of the first conductivity type, wherein at least a portion of the third semiconductor region lies adjacent to the trench above the second semiconductor region and provides a second source/drain region for the first FET, wherein the third semiconductor region also provides a source/drain region for the second FET;

    a fourth semiconductor region of the second conductivity type adjacent to the third semiconductor region and providing a channel region for the second FET; and

    a fifth semiconductor region of the first conductivity type adjacent to the fourth semiconductor region and providing a source/drain region for the second FET;

    wherein the integrated circuit further comprises a conductive member having a portion overlying the trench, wherein the conductive member provides a gate for the second FET.

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