Camera module and manufacturing method thereof

• US 20040207036A1
• Filed: 02/05/2004
• Published: 10/21/2004
• Est. Priority Date: 01/27/2003
• Status: Active Grant

• Current Assignee: Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Inventors: Ikeda, Osamu
• Granted Patent: US 6,853,005 B2
• Time in Patent Office: Days
• US Class Current: 257/432
• CPC Class Codes: H01L 27/14623 Optical shielding
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

A camera module for a mobile device is reduced in size and manufacturing cost. A filter material made of a multi-layer thin film is bonded to a surface of a lens which is bonded to a surface of an image sensor chip. The filter material is a filter to block radiation within a predetermined range of wave length in an incident radiation to the lens, for example, an IR filter to block infrared radiation. An iris material made of a film such as an acrylic film or a polyolefin film is bonded to the lens covered with the filter material.

Claims

1. A camera module comprising:

an image sensor chip comprising a photoelectronic transducer disposed in a top surface thereof and a terminal for external connection disposed on a back surface thereof;

a lens supported on the top surface of the image sensor chip; and

a filter formed on a surface of the lens and comprising a plurality of thin films.

2. The camera module of claim 1, wherein one of the thin films comprises a metal film.

3. The camera module of claim 1, wherein the lens comprises a lens body and a lens frame, and the filter is formed only on the lens body.

4. The camera module of claim 3, further comprising an iris material bonded to a surface of the lens frame.

5. A manufacturing method of a camera module comprising:

providing an image sensor wafer comprising a plurality of image sensor chips, each of the image sensor chips comprising a photoelectronic transducer disposed in a top surface thereof and a terminal for external connection disposed on a back surface thereof;

providing a lens array comprising a plurality of lenses;

performing a deposition on a surface of the lens array so as to form a filter comprising a plurality of thin films;

bonding the lens array and the image sensor wafer to form a bonded unit; and

dividing the bonded unit into individual camera modules so that each of the camera modules includes one of the image sensor chips and one of the lenses.

6. The manufacturing method of claim 5, wherein the deposition is a vacuum deposition.

7. The manufacturing method of claim 5, wherein the lens array is formed in a horizontal shape substantially the a same as the image sensor wafer.

8. The manufacturing method of claim 5, wherein the lens array comprises a plurality of individual sub arrays of at least two different kinds.

9. The manufacturing method of claim 5, wherein the lens array comprises a plural of rectangular sub arrays.

10. The manufacturing method of claim 5, wherein the deposition is performed so that only portions of the les array corresponding to the lenses are covered by the filter.