Semiconductor component for electrical coupling to a substrate, and method of manufacturing same

• US 20040207054A1
• Filed: 04/21/2003
• Published: 10/21/2004
• Est. Priority Date: 04/21/2003
• Status: Active Grant

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Chow, Wai Wong, Brown, Clem H., Mosna, Frank J. Jr.
• Granted Patent: US 6,949,816 B2
• Time in Patent Office: Days
• US Class Current: 257/676
• CPC Class Codes: A61B 5/0002 Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network A61B5/07 takes precedence; transmission systems for measured values G08C; transmission H04B; transmission of digital information H04L; wireless communication networks H04W
• CPC Class Codes: A61B 5/14532 for measuring glucose, e.g. by tissue impedance measurement
• CPC Class Codes: A61B 5/14546 for measuring analytes not otherwise provided for, e.g. ions, cytochromes
• CPC Class Codes: A61B 5/7445 Display arrangements, e.g. multiple display units
• CPC Class Codes: G16H 15/00 ICT specially adapted for medical reports, e.g. generation or transmission thereof
• CPC Class Codes: G16H 40/67 for remote operation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: Y02A 90/10 : Information and communication technologies [ICT] supporting adaptation to climate change, e.g. for weather forecasting or climate simulation

Abstract

A semiconductor component for electrical coupling to a substrate (230) includes: a semiconductor chip (110); a non-leaded leadframe (120) including a plurality of electrical contacts (130) located around a periphery (111) of the semiconductor chip; a first electrical conductor (140) electrically coupling together the semiconductor chip and the non-leaded leadframe; and a mold compound (210) disposed around the semiconductor chip, the first electrical conductor, and the plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts includes: a first surface (310) having a first surface area for electrically coupling to the semiconductor chip; and a second surface (320) opposite the first surface and having a second surface area for electrically coupling to the substrate, where the second surface area is larger than the first surface area.

Claims

1. A semiconductor component for electrical coupling to a substrate, the semiconductor component comprising:

a semiconductor chip;

a non-leaded leadframe comprising a plurality of electrical contacts located around a periphery of the semiconductor chip;

a first electrical conductor electrically coupling together the semiconductor chip and the non-leaded leadframe; and

a mold compound disposed around the semiconductor chip, the first electrical conductor, and the plurality of electrical contacts, wherein;

at least one electrical contact of the plurality of electrical contacts comprises;

a first surface having a first surface area for electrically coupling to the semiconductor chip; and

a second surface opposite the first surface and having a second surface area for electrically coupling to the substrate; and

the second surface area is larger than the first surface area.

2. The semiconductor component of claim 1 wherein:

the at least one electrical contact comprises a trapezoidal cross-sectional shape.

3. The semiconductor component of claim 1 wherein:

the at least one electrical contact further comprises;

a side surface coupling together the first surface and the second surface; and

the side surface has a first concave section and a second concave section adjacent to the first concave section.

4. The semiconductor component of claim 3 wherein:

the first concave section and the second concave section form at least one mold lock feature.

5. The semiconductor component of claim 3 wherein:

the first concave section is located between the first surface and the second concave section; and

the second concave section is located between the second surface and the first concave section.

6. The semiconductor component of claim 5 wherein:

the first concave section has a first radius of curvature; and

the second concave section has a second radius of curvature less than the first radius of curvature.

7. The semiconductor component of claim 1 wherein:

the at least one electrical contact further comprises;

a side surface coupling the first surface to the second surface and comprising at least one mold lock feature.

8. The semiconductor component of claim 1 wherein:

the first surface comprises at least one mold lock feature.

9. The semiconductor component of claim 8 wherein:

the at least one mold lock feature comprises a recess within the first surface.

10. The semiconductor component of claim 1 wherein:

the second surface has a substantially constant width.

11. The semiconductor component of claim 1 wherein:

the second surface has a first section having a first width and a second section having a second width; and

the second width is less than the first width.

12. The semiconductor component of claim 1 wherein:

the first surface has a first length and a first width;

the second surface has the first length and a second width; and

the second width is greater than the first width.

13. The semiconductor component of claim 1 wherein:

the non-leaded leadframe has a thickness of at least 0.5 centimeters.

14. The semiconductor component of claim 1 wherein:

the second surface of the at least one electrical contact has a first section having a first width and a second section having a second width;

the second width is less than the first width; and

the second surface of another electrical contact of the plurality of electrical contacts has a substantially constant width substantially equal to the first width.

15. A semiconductor component for electrical coupling to a substrate, the semiconductor component comprising:

a semiconductor chip;

a non-leaded leadframe comprising a plurality of electrical contacts located around a periphery of the semiconductor chip; and

a mold compound disposed around the semiconductor chip and the plurality of electrical contacts;

wherein;

each electrical contact in the plurality of electrical contacts comprises;

a first surface having a first surface area for electrical coupling to the semiconductor chip; and

a second surface opposite the first surface and having a second surface area for electrical coupling to the substrate;

the second surface area is larger than the first surface area; and

each electrical contact of the plurality of electrical contacts comprises a trapezoidal cross-sectional shape.

16. The semiconductor component of claim 15 wherein:

each electrical contact in the plurality of electrical contacts further comprises;

a side surface coupling together the first surface and the second surface; and

each side surface comprises at least one mold lock feature.

17. The semiconductor component of claim 16 wherein:

the at least one mold lock feature comprises;

a first mold lock feature comprising a first concave section in the side surface; and

a second mold lock feature comprising a second concave section in the side surface and adjacent to the first concave section.

18. The semiconductor component of claim 17 wherein:

the first concave section has a first radius of curvature; and

the second concave section has a second radius of curvature less than the first radius of curvature.

19. The semiconductor component of claim 17 wherein:

the first mold lock feature is located between the first surface and the second mold lock feature; and

the second mold lock feature is located between the second surface and the first mold lock feature.

20. The semiconductor component of claim 16 wherein:

the first surface comprises a first mold lock feature.

21. The semiconductor component of claim 20 wherein:

the first mold lock feature comprises a notch.

22. The semiconductor component of claim 20 wherein:

the first mold lock feature comprises a notch; and

the at least one mold lock feature comprises;

a second mold lock feature comprising a first concave section in the side surface; and

a third mold lock feature comprising a second concave section in the side surface and adjacent to the second mold lock feature.

23. The semiconductor component of claim 22 wherein:

the second mold lock feature is located between the first surface and the third mold lock feature; and

the third mold lock feature is located between the second surface and the second mold lock feature.

24. The semiconductor component of claim 20 wherein:

the second surface has a substantially constant width.

25. The semiconductor component of claim 20 wherein:

the second surface has a first section having a first width, a second section having a second width, and a third section coupling together the first section and the second section; and

the second width is less than the first width.

26. The semiconductor component of claim 25 wherein:

the first surface has a first length and the second width; and

the second surface has the first length.

27. The semiconductor component of claim 25 wherein:

the first surface has a first length and the second width; and

the second surface has a second length greater than the first length.

28. The semiconductor component of claim 27 wherein:

the second surface of a second one of the plurality of electrical contacts has a constant width substantially equal to the first width.

29. The semiconductor component of claim 15 wherein:

the non-leaded leadframe has a thickness of at least 0.5 centimeters.

30. A method of manufacturing a semiconductor component for electrical coupling to a substrate, the method comprising:

providing a non-leaded leadframe comprising;

a plurality of electrical contacts;

wherein;

each one of the plurality of electrical contacts comprises;

a first surface having a first surface area; and

a second surface opposite the first surface and having a second surface area; and

the second surface area is larger than the first surface area;

mounting a semiconductor chip adjacent to the non-leaded leadframe;

coupling a first electrical conductor between the first surface of a first one of the plurality of electrical contacts and the semiconductor chip;

disposing a mold compound around the semiconductor chip, the first electrical conductor, and the plurality of electrical contacts; and

coupling a second electrical conductor between the second surface of the first one of the plurality of electrical contacts and the substrate.