Tape carrier for TAB and method for producing the same

• US 20040207069A1
• Filed: 12/08/2003
• Published: 10/21/2004
• Est. Priority Date: 12/09/2002
• Status: Active Grant

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Naito, Toshiki, Yamazaki, Hiroshi, Omote, Toshihiko
• Granted Patent: US 7,439,451 B2
• Time in Patent Office: Days
• US Class Current: 257/700
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 2201/10681 Tape Carrier Package [TCP]; Flexible sheet connector
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence

Abstract

Only individual piece-like flexible wiring boards 1 produced separately and judged to be non-defective products in an inspection step in advance are mounted at regular intervals on a carrying support film 7 to thereby obtain a TAB tape carrier. According to this method, the yield on continuous production can be improved while the step of replacing defective flexible wiring boards found by inspection with non-defective flexible wiring boards can be omitted after mounting of the flexible wiring boards 1. A difference in level between the respective flexible wiring boards can be prevented from being caused by the replacement, so that high connection reliability can be ensured.

Claims

1. A tape carrier for TAB comprising:

a carrying support film, and

individual pieces of flexible wiring boards judged to be non-defective products in an inspection step;

wherein said flexible wiring boards are mounted at regular intervals on said carrying support film.

2. A tape carrier for TAB according to claim 1, wherein each of said flexible wiring boards is mounted on said carrying support film through an adhesive agent.

3. A tape carrier for TAB according to claim 1, wherein opening portions are formed in portions of said carrying support film on which said flexible wiring boards is to be mounted respectively.

4. A tape carrier for TAB according to claim 1, wherein said carrying support film is a polyimide film.

5. A method of producing a tape carrier for TAB, comprising:

a production step of producing individual piece-like flexible wiring boards;

an inspection step of inspecting said individual piece-like flexible wiring boards; and

a mounting step of mounting only individual piece-like flexible wiring boards judged to be non-defective products in the inspection step, at regular intervals on a carrying support film.