Integrated set/reset driver and magneto-resistive sensor
First Claim
1. A sensing apparatus comprising:
- at least one magneto-resistive-sensing element;
at least one reorientation element for adjusting the at least one magneto-resistive-sensing element; and
semiconductor circuitry having driver circuitry for controlling the at least one reorientation element, wherein the at least one magneto-resistive-sensing element, the at least one reorientation element, and the semiconductor circuitry are disposed in a single package.
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Accused Products
Abstract
A magnetic-sensing apparatus and methods of making and using thereof are disclosed. The sensing apparatus may have one or more magneto-resistive-sensing elements, one ore more reorientation elements for adjusting the magneto-resistive-sensing elements, and semiconductor circuitry having driver circuitry for controlling the reorientation elements. The magneto-resistive-sensing elements, reorientation elements and semiconductor circuitry may be disposed in single package and/or monolithically formed on a single chip. Alternatively, some of the semiconductor circuitry may be monolithically formed on a first chip with the magneto-resistive-sensing elements, while a second portion of the semiconductor circuitry may be formed on a second chip. The first and second chips may be placed in close proximity and electrically connected together. Alternatively the chips may have no intentional electrical interaction. Exemplary semiconductor devices that might be implemented include, without limitation, capacitors, inductors, operational amplifiers, set/reset circuitry for the MR sensors, accelerometers, pressure sensors, position-sensing circuitry, compassing circuitry, etc.
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Citations
43 Claims
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1. A sensing apparatus comprising:
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at least one magneto-resistive-sensing element;
at least one reorientation element for adjusting the at least one magneto-resistive-sensing element; and
semiconductor circuitry having driver circuitry for controlling the at least one reorientation element, wherein the at least one magneto-resistive-sensing element, the at least one reorientation element, and the semiconductor circuitry are disposed in a single package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
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Specification