×

Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge

  • US 20040209413A1
  • Filed: 05/07/2004
  • Published: 10/21/2004
  • Est. Priority Date: 09/28/2001
  • Status: Active Grant
First Claim
Patent Images

1. A method of fabricating a MEMS structure, comprising the steps of:

  • (a) providing a wafer having at least a first insulating layer and a second layer;

    (b) removing a portion of the first layer through to the second layer to form a bridge member from the first layer;

    (c) providing a substrate defining an upper surface, wherein a recess is formed in at least one of the substrate and the wafer;

    (d) after step (c), attaching the wafer to the upper surface of the substrate to form a composite structure having an internal void formed therein, wherein the bridge member is aligned with the internal void, and (e) etching through the second layer of the wafer around the periphery of the bridge member to break through into the void and release the bridge from the substrate.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×