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Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof

  • US 20040209453A1
  • Filed: 05/18/2004
  • Published: 10/21/2004
  • Est. Priority Date: 07/20/1994
  • Status: Abandoned Application
First Claim
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1. A method for fabricating an integrated electronic device having an electric connection connecting a first electrode of a first substrate with a second electrode of a second substrate, surfaces of the first and second electrodes having repellant and adhesive tendencies to molten metal, respectively, the method comprising the steps of:

  • forming a first soldering metal bump on the surface of the first electrode, the first soldering metal bump including at least one of components of an eutectic alloy having an eutectic temperature, wherein the first soldering metal bump has a first melting temperature;

    forming a second soldering metal bump on the surface of the second electrode, the second soldering metal bump including the rest of the components of the eutectic alloy, wherein the second soldering metal bump has a second melting temperature;

    aligning the first and second soldering metal bumps to each other, and then keeping both in contact with each other; and

    heating the first and second soldering metal bumps at such a connection temperature that a connection part made of the eutectic alloy is formed between the first and second soldering metal bumps, wherein the connection temperature is higher than the eutectic temperature and lower than the melting temperatures of the first and second soldering metal bumps.

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