Multilayer substrate

• US 20040212076A1
• Filed: 05/12/2004
• Published: 10/28/2004
• Est. Priority Date: 09/27/2002
• Status: Active Grant

• Current Assignee: Medtronic Minimed Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Minimed Incorporated (Medtronic Plc)
• Inventors: Shah, Rajiv, Pendo, Shaun, Babiracki, Edward G.
• Granted Patent: US 7,297,627 B2
• Time in Patent Office: Days
• US Class Current: 257/701
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 2201/0179 Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
• CPC Class Codes: H05K 2203/0278 Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 3/4061 for via connections in inorganic insulating substrates
• CPC Class Codes: H05K 3/4647 by applying an insulating layer around previously made via studs
• CPC Class Codes: H05K 3/4667 characterized by using an inorganic intermediate insulating layer
• CPC Class Codes: H05K 3/467 Adding a circuit layer by thin film methods H05K3/4647 takes precedence

Abstract

A multilayer substrate device formed from a base substrate and alternating metalization layers and dielectric layers. Each layer is formed without firing. Vias may extend through one of the dielectric layers such that two metalization layers surrounding the dielectric layers make. contact with each other. The vias may be formed by placing pillars on top of a metalization layer, forming a dielectric layer on top of the metalization layer and surrounding the pillars, and removing the pillars. Dielectric layers may be followed by other dielectric layers and metalization layers may be followed by other metalization layers. Vias in the substrate may be filled by forming an assembly around the substrate, the assembly including printing sheets containing a conductive ink and pressure plates for applying pressure. A vacuum may be applied to remove air in the ink. Pressure may then be applied to the printing sheets through the pressure plates. The conductive ink in the printing sheets is pushed through the vias when pressure is applied by the pressure plates.

Claims

1-7. -7. (canceled)

8. A method for forming a multilayer substrate comprising:

obtaining a base substrate; and

forming a first metalization layer on the base substrate without firing.

9. The method of claim 8, further comprising forming a plurality of alternating dielectric layers and metalization layers over the first metalization layer.

10. The method of claim 9, wherein a layer of the plurality of dielectric layers is formed by ion beam assist deposition.

11. The method of claim 9, wherein a layer of the plurality of dielectric layers is formed by sputtering.

12. The method of claim 9, wherein a layer of the plurality of dielectric layers is formed by chemical vapor deposition.

13. The method of claim 9, wherein a layer of the plurality of dielectric layers is formed by epitaxial deposition.

14. The method of claim 9, wherein a layer of the plurality of dielectric layers is formed by evaporation.

15. The method of claim 9, wherein forming a plurality of dielectric layers comprises:

forming an opening in a mask;

affixing the mask to a layer of the substrate;

depositing an active material in the openings;

removing the mask after the active material has been deposited;

forming a dielectric around the active material; and

removing the active material after the dielectric has been formed around the active material.

16. The method of claim 15, wherein a height of the dielectric layer is less than a height of the active material.

17. The method of claim 16, wherein the height of the dielectric layer is about one-half the height of the active material.

18. The method of claim 16, wherein the height of the dielectric layer is about one-third the height of the active material.

19. The method of claim 15, wherein forming the active material results in a formation of pillars on one of the plurality of metalization layers.

20. The method of claim 15, wherein vias are formed through one of the plurality of dielectric layers when the active material is removed.

21. The method of claim 15, wherein removing the active material after the dielectric has been formed around the active material comprises exposing the active material to a dissolving solution.

22. The method of claim 21, the dissolving solution is ferric chloride.

23. An assembly for fabricating substrates comprising:

first and second pressure plates for applying pressure;

first and second assembly plates, the first assembly plate located adjacent the first pressure plate and the second assembly plate located adjacent the second pressure plate;

first and second printing sheets for printing on a substrate, the first printing sheet located adjacent the first assembly plate and the second printing sheet located adjacent the second assembly plate; and

an enclosure surrounding the first and second assembly plates, the first and second printing sheets, and the substrate,

wherein the first pressure plate and the first printing sheet surround the first assembly plate and the second pressure plate and the second printing sheet surround the second assembly plate, and

wherein the first pressure plate, the first assembly plate and the first printing sheet are located adjacent a first side of the substrate and the second pressure plate, the second assembly plate and the second printing sheet are located adjacent a second side of the substrate.

24. The assembly of claim 23, wherein a pressure applied by the first pressure plate and the second pressure plate acts through the first assembly plate and the second assembly plate to force ink in the first printing sheet and the second printing sheet through vias in the substrate.

25. The assembly of claim 23, wherein the enclosure comprises a port for pulling a vacuum in the enclosure.

26. The assembly of claim 23, wherein the first and second printing sheets are made from foam rubber.

27. A method for filling vias in a substrate comprising:

forming an assembly around the substrate, the assembly including printing sheets for containing a conductive ink, the assembly further including pressure plates for applying pressure;

applying a vacuum about the assembly; and

applying pressure to the printing sheets;

wherein the conductive ink in the printing sheets is pushed through the vias when pressure is applied by the pressure plates.

28. The method of claim 27, further comprising printing a pattern on the substrate;

drying the substrate; and

firing the substrate.

29. The method of claim 27, wherein forming an assembly around the substrate comprises:

positioning a first printing sheet adjacent a first side of the substrate;

positioning a first assembly plate adjacent the first printing sheet;

positioning a first pressure plate adjacent the first assembly plate;

positioning a second printing sheet adjacent a second side of the substrate;

positioning a second assembly plate adjacent the second printing sheet;

positioning a second pressure plate adjacent the second assembly plate; and

positioning an enclosure around at least the substrate and the first and second printing sheets.

30. The method of claim 27, wherein applying a vacuum about the assembly comprises pulling a vacuum in the enclosure.

31. The method of claim 30, wherein air is removed from the conductive ink when a vacuum is pulled in the enclosure.

32. The method of claim 27, wherein applying a pressure to the printing sheets comprises applying a low pressure.

33. The method of claim 27, wherein applying a pressure to the printing sheets comprises applying a high pressure.

34. The method of claim 33, wherein applying a high pressure comprises applying about 1000 lbs.