Solid-state imaging device and method for producing the same
First Claim
1. A solid-state imaging device, comprising:
- a substrate with a flat board form that is made of an insulating resin;
an imaging element that is fixed onto the substrate;
a rib with a rectangular frame form in a planar shape, which is provided on the substrate so as to surround the imaging element;
a transparent plate that is fixed to a top face of the rib;
a plurality of wirings for conducting electricity from inside of a package to outside of the package, the package being comprised of the substrate, the rib and the transparent plate; and
thin metal wires provided in a space within the package, which connect electrodes of the imaging element with the respective wirings, wherein each of the plurality of wirings includes;
an internal electrode disposed on a surface with the imaging element mounted thereon;
an external electrode disposed on a rear surface of the imaging-element mounted surface and at a position corresponding to the internal electrode; and
an end face electrode disposed on an end face of the substrate, which connects the internal electrode and the external electrode, and an end face of the substrate, a side face of the rib and an end face of the transparent plate, which correspond to a side face of the package, form a substantially coplanar surface.
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Accused Products
Abstract
A solid-state imaging device includes: a planar substrate; an imaging element fixed onto the substrate; a rib provided on the substrate so as to surround the imaging element; a transparent plate fixed to a top face of the rib; a plurality of wirings for conducting electricity from inside of a package to outside of the same, the package being composed of the substrate, the rib and the transparent plate; and thin metal wires for connecting electrodes of the imaging element with the respective wirings. Each of the wirings includes: an internal electrode disposed on a surface with the imaging element mounted thereon; an external electrode disposed on a rear surface of the imaging-element mounted surface and at a position corresponding to the internal electrode and an end face electrode disposed on an end face of the substrate, for connecting the internal electrode and the external electrode. An end face of the substrate, a side face of the rib and an end face of the transparent plate form a substantially coplanar surface. The structure of the substrate having an external terminal is simple, thus facilitating the miniaturization of the device.
57 Citations
16 Claims
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1. A solid-state imaging device, comprising:
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a substrate with a flat board form that is made of an insulating resin;
an imaging element that is fixed onto the substrate;
a rib with a rectangular frame form in a planar shape, which is provided on the substrate so as to surround the imaging element;
a transparent plate that is fixed to a top face of the rib;
a plurality of wirings for conducting electricity from inside of a package to outside of the package, the package being comprised of the substrate, the rib and the transparent plate; and
thin metal wires provided in a space within the package, which connect electrodes of the imaging element with the respective wirings, wherein each of the plurality of wirings includes;
an internal electrode disposed on a surface with the imaging element mounted thereon;
an external electrode disposed on a rear surface of the imaging-element mounted surface and at a position corresponding to the internal electrode; and
an end face electrode disposed on an end face of the substrate, which connects the internal electrode and the external electrode, andan end face of the substrate, a side face of the rib and an end face of the transparent plate, which correspond to a side face of the package, form a substantially coplanar surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification