Electronic circuit apparatus and method of manufacturing the same
First Claim
1. A electronic circuit apparatus comprising:
- at least two wiring circuit boards each of which is mounted with at least two electronic components;
a heat sink on which said wiring circuit boards are fixed, said heat sink having a higher heat conductivity than that of said wiring circuit boards;
an external connection terminal electrically connected to said wiring circuit boards; and
a thermosetting resin composition with which the entire surfaces of said wiring circuit boards, a part of said heat sink and a part of said external connection terminal are integrally molded, wherein;
said wiring circuit boards on which all necessary electronic components are mounted in advance are fixed to the top and bottom of said heat sink via an adhesive layer.
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Accused Products
Abstract
A resin-sealed electronic circuit apparatus capable of maintaining a high heat-dissipating property and packaging density in applications where high hermetic-sealing property and durability are required. The electronic circuit apparatus comprises at least two wiring circuit boards 12 and 13 on which electronic components are mounted. The wiring circuit boards 12 and 13 are fixed to a heat sink 14 having a high heat conductivity via an adhesive 9 and 10. The entirety of the wiring circuit boards 12 and 13 and heat sink 14, as well as a part of an external connection terminal 8 are hermetically sealed and integrally molded by a thermosetting resin composition 7. The electronic circuit apparatus is small and highly reliable and can be provided at low cost.
119 Citations
17 Claims
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1. A electronic circuit apparatus comprising:
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at least two wiring circuit boards each of which is mounted with at least two electronic components;
a heat sink on which said wiring circuit boards are fixed, said heat sink having a higher heat conductivity than that of said wiring circuit boards;
an external connection terminal electrically connected to said wiring circuit boards; and
a thermosetting resin composition with which the entire surfaces of said wiring circuit boards, a part of said heat sink and a part of said external connection terminal are integrally molded, wherein;
said wiring circuit boards on which all necessary electronic components are mounted in advance are fixed to the top and bottom of said heat sink via an adhesive layer. - View Dependent Claims (2, 3, 7, 12, 13, 14, 15, 16, 17)
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4. A method of manufacturing an electronic circuit apparatus comprising the steps of:
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fixing at least two wiring circuit boards each of which is mounted with at least two electronic components to a heat sink having a higher heat conductivity than that of said wiring circuit boards;
electrically connecting an external connection terminal with said wiring circuit boards;
integrally molding the entire surfaces of said wiring circuit boards, a part of said heat sink and a part of said external connection terminal with a thermosetting resin composition, said method further comprising the step of;
fixing said wiring circuit boards on which said electronic components are mounted to the top and bottom of said heat sink via an adhesive layer. - View Dependent Claims (5)
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6. An electronic circuit apparatus comprising:
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a wiring circuit board on which at least two electronic components are mounted;
a heat sink to which said wiring circuit board is fixed, said heat sink having a higher heat conductivity than that of said wiring circuit board;
an external connection terminal electrically connected to said wiring circuit board; and
a thermosetting resin composition with which the entire surface of said wiring circuit board, at least a part of said heat sink and a part of said external connection terminal are integrally molded, wherein;
a part of a passage for circulating a cooling medium is formed in an external layer of said electronic circuit apparatus. - View Dependent Claims (8, 9, 10, 11)
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Specification