Highly parallel optical communication system with intracard and intercard communications

• US 20040213503A1
• Filed: 09/19/2002
• Published: 10/28/2004
• Est. Priority Date: 09/19/2002
• Status: Active Grant

• Current Assignee: Broadcom International Pte Ltd. (Broadcom, Inc.)
• Original Assignee: Avago Technologies Fiber IP Singapore PTE Limited (Broadcom, Inc.)
• Inventors: Buckman, Lisa A., Cham, Kit M.
• Granted Patent: US 7,653,272 B2
• Time in Patent Office: Days
• US Class Current: 385/14
• CPC Class Codes: G02B 6/3512 the optical element being reflective, e.g. mirror
• CPC Class Codes: G02B 6/3546 NxM switch, i.e. a regular array of switches elements of matrix type constellation
• CPC Class Codes: G02B 6/3596 With planar waveguide arrangement, i.e. in a substrate, regardless if actuating mechanism is outside the substrate
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Abstract

An optical communications system including a method and apparatus with an electro-optical chip which includes optical interface elements in optical interface array configuration on a first side of the electro-optical chip, attached to or integrated with an optical circuit board which includes a plurality of layered optical wave guides, a plurality of coupling elements disposed relative to the electro-optical chip such that the plurality of coupling elements optically communicate with the first plurality of optical interface elements on the electro-optical chip, and wherein the coupling elements are further disposed to optically communicate with the plurality of optical wave guides.

Claims

1. An optical communications system comprising:

an electro-optical chip with a first plurality of optical interface elements in an optical interface array configuration on a first side of the electro-optical chip; and

an optical circuit board comprising;

a plurality of layered optical waveguides;

a plurality of coupling elements;

disposed relative to the electro-optical chip such that the plurality of coupling elements optically communicate with the first plurality of optical interface elements on the electro-optical chip; and

further disposed to optically communicate with the plurality of optical waveguides.

2. An optical communications system as recited in claim 1, and further wherein the first plurality of optical interface elements in the optical interface array configuration on the electro-optical chip transmit optical waves to the plurality of coupling elements, which redirect the optical waves through the optical waveguides.

3. An optical communications system as recited in claim 1, and wherein the electro-optical chip is assembled on the optical circuit board.

4. An optical communications system as recited in claim 1, and wherein the electro-optical chip is integrated with the optical circuit board by flip-chip bonding.

5. An optical communications system as recited in claim 1, and wherein the electro-optical chip includes at least one semiconductor laser.

6. An optical communications system as recited in claim 1, and wherein the electro-optical chip includes at least one vertical cavity surface emitting lasers.

7. An optical communications system as recited in claim 1, and wherein micro-optic inputs and outputs are integrated with the lasers or detectors at the optical interface elements.

8. An optical communications system as recited in claim 1, and wherein the electro-optical chip includes at least one high speed photo detector.

9. An optical communications system as recited in claim 1, and wherein the electro-optical chip is a multi-chip module.

10. An optical communications system as recited in claim 1, and further wherein the plurality of coupling elements are disposed to receive the plurality of optical waves from the first plurality of optical interface elements in a direction transverse to the plurality of waveguides, and to direct the plurality of optical waves longitudinally in the plurality of waveguides.

11. An optical communications system as recited in claim 1, and further wherein the plurality of coupling elements are disposed to receive the plurality of optical waves from the plurality of waveguides, and to direct the plurality of optical waves to the first plurality of optical interface elements in the optical interface array configuration on the electro-optical chip.

12. An optical communications system as recited in claim 1, and further wherein the plurality of optical coupling elements are diffractive optics elements.

13. An optical communications system as recited in claim 1, and further wherein the plurality of optical coupling elements are micromachine-controlled micro-mirrors which couple optical waves from one of the first plurality of optical interface elements and the plurality of waveguides, to the other of the first plurality of optical interface elements and the plurality of waveguides.

14. An optical communications system as recited in claim 13, and further wherein the micromachine controlled micro mirror further comprises a switch which selectively couples the plurality of optical waves to one of the waveguides and another optical element.

15. An optical communications system as recited in claim 1, and further wherein the plurality of optical coupling elements includes one or more reflective elements having reflective surfaces to redirect an optical wave from an original direction to a second direction to one of a plurality of waveguides.

16. An optical communications system as recited in claim 1, and wherein the electro-optical chip further comprises a second plurality of optical interface elements also in an optical interface array configuration on a second side of the electro-optical chip, the second plurality of optical interface elements configured for free space optical communication utilizing optical waves.

17. An optical communications system comprising:

a first electro-optical chip with a first plurality of optical interface elements in an optical interface array configuration on a first side of the first electro-optical chip, and a second plurality of optical interface elements in an optical interface array configuration on a second side of the first electro-optical chip, the second plurality of optical interface elements configured for free space optical communication utilizing optical waves; and

a first optical circuit board with a first plurality of layered optical waveguides, and with a plurality of coupling elements disposed relative to the first electro-optical chip such that the plurality of coupling elements optically communicate with the first plurality of optical interface elements on the first electro-optical chip and are further disposed to optically communicate with the first plurality of layered optical waveguides; and

a second electro-optical chip with a first plurality of optical interface elements in an optical interface array configuration on a first side of the electro-optical chip, the first plurality of optical interface elements on the second electro-optical chip being disposed for free space communication with the second plurality of optical interface elements on the second side of the first electro-optical chip.

18. An optical communications system as recited in claim 17, and further comprising a second optical circuit board with a second plurality of layered optical waveguides, and with a second plurality of coupling elements disposed relative to the second electro-optical chip such that the plurality of coupling elements optically communicate with the second plurality of optical interface elements on the second electro-optical chip and are further disposed to optically communicate with the second plurality of layered optical waveguides.

19. An optical communications system comprising:

an optical circuit board comprising;

a plurality of layers of optical waveguides; and

a plurality of coupling elements disposed to receive optical beams from the optical waveguides and re-direct the plurality of optical beams to a plurality of optical inputs in an optical interface array configuration on an electro-optical chip operatively attached to the optical an optical circuit board.

20. An optical communications system comprising:

an electro-optical chip with a plurality of optical outputs in an optical interface array configuration, the electro-optical chip being operatively attached to an optical circuit board;

the optical circuit board comprising;

a plurality of layers of optical waveguides; and

a plurality of means for coupling the plurality of optical outputs to the plurality of layers of optical waveguides.

21. An optical communications system comprising:

an optical circuit board comprising;

a plurality of layers of optical wave guide means; and

a plurality coupling means disposed to receive optical waves from the plurality of layers of optical wave guide means and redirect the optical waves to a plurality of optical interface elements in an optical interface array configuration on an electro-optical chip operatively attached to the optical circuit board.

22. A method of communicating data to and through an optical circuit board comprising the following:

providing an electro-optical chip with a first plurality of optical interface elements in an optical interface array configuration on a first side of the electro-optical chip; and

providing a first optical circuit board with a plurality of layered optical waveguides;

transmitting a plurality of optical waves from the first plurality of optical interface elements on the first side of the electro-optical chip to a plurality of coupling elements disposed relative to the first plurality of optical interface elements on the electro-optical chip such that the plurality of coupling elements receive optical waves from the first plurality of optical interface elements on the electro-optical chip and redirect the optical waves through the plurality of optical waveguides.

23. A method of communicating data to and through an optical circuit board as recited in claim 22, and further comprising the following:

providing the electro-optical chip with a second plurality of optical interface elements also in an optical interface array configuration on a second side of the electro-optical chip, the second plurality of optical interface elements being disposed to receive optical waves from another optical device.

24. A method of communicating data to and through an optical circuit board comprising the following:

providing an electro-optical chip with a first plurality of optical interface elements in an optical interface array configuration on a first side of the electro-optical chip; and

providing a first optical circuit board with a plurality of layered optical waveguides;

providing a second optical circuit board with a plurality of optical signal passageways through the second optical circuit board, the plurality of optical signal passageways being disposed between the first plurality of optical interface elements on the first side of the electro-optical chip and a plurality of coupling elements on the first optical circuit board;

transmitting a plurality of optical waves from the first plurality of optical interface elements on the first side of the electro-optical chip through corresponding ones of the plurality of optical signal passageways in the second optical circuit board, and to the plurality of coupling elements on the first optical circuit board disposed relative to the first plurality of optical interface elements on the electro-optical chip such that the plurality of coupling elements receive optical waves from the first plurality of optical interface elements on the electro-optical chip and redirect the optical waves through the plurality of optical waveguides.

25. A method of communicating data to and through an optical circuit board as recited in claim 24, and further wherein the plurality of optical passageways are apertures in the second optical circuit board.

26. An optical communications system comprising:

an electro-optical chip with a first plurality of optical interface elements in an optical interface array configuration on a first side of the electro-optical chip;

a first optical circuit board comprising;

a plurality of layered optical waveguides;

a plurality of coupling elements disposed relative to the electro-optical chip such that the plurality of coupling elements optically communicate with the first plurality of optical interface elements on the electro-optical chip, and which are further disposed to optically communicate with the plurality of optical waveguides;

a second optical circuit board disposed between the electro-optical chip and the first optical circuit board, the second optical circuit board comprising;

a plurality of optical signal passageways respectively disposed between the optical interface elements on the electro-optical chip and the plurality of coupling elements on the first optical circuit board and which allow passage of optical signals through the second optical circuit board.