Apparatus and method for array alignment

• US 20040214310A1
• Filed: 04/25/2003
• Published: 10/28/2004
• Est. Priority Date: 04/25/2003
• Status: Abandoned Application

• Current Assignee: Agilent Technologies, Inc.
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Tso, Jacqueline, Parker, Russell A.
• Application Number:
  US10/424,175
• Publication Number:
  US 20040214310A1
• Time in Patent Office: Days
• US Class Current: 435/287.2
• CPC Class Codes: B01L 2200/025 Align devices or objects to ensure defined positions relative to each other
• CPC Class Codes: B01L 2200/0689 Sealing
• CPC Class Codes: B01L 2300/0636 Integrated biosensor, microarrays
• CPC Class Codes: B01L 2300/0822 Slides
• CPC Class Codes: B01L 3/508 rigid containers not provided for above

Abstract

An apparatus and method for array alignment. The apparatus employs a standoff that is adjacent to a gasket and that may be attached to a first substrate or a second substrate. The standoff is larger in height than the gasket that holds an array solution. The larger height of the standoff relative to the gasket helps during the alignment of the first substrate and the second substrate and prevents the spreading or spillage of the array solution when attempts are made to contact the first substrate to the second substrate. Methods of making and aligning the array hybridization apparatus are also disclosed.

Claims

1. An array hybridization apparatus, comprising:

(a) a first substrate for holding an array;

(b) a second substrate opposite the first substrate for acting as a backing for the array hybridization apparatus;

(c) a gasket for holding an array solution;

(d) a standoff adjacent to the gasket and interposed between the first substrate and the second substrate for maintaining a space between the gasket and first substrate.

2. An array hybridization apparatus as recited in claim 1, wherein the height of the standoff is greater than the height of the gasket.

3. An array hybridization apparatus as recited in claim 1, wherein the standoff comprises a deformable material.

4. An array hybridization apparatus as recited in claim 1, wherein the standoff is attached to the first substrate.

5. An array hybridization apparatus as recited in claim 1, wherein the standoff is attached to the second substrate.

6. An array hybridization apparatus as recited in claim 1, wherein the standoff is attached to both the first substrate and the second substate.

7. An array hybridization apparatus as recited in claim 1, wherein the compressible or flexible standoff comprises a material selected from the group consisting of natural rubber, ethylene propylene rubbers, silicone, fluorocarbons, polyurethanes, acrylonitrile buna n'"'"'s, neoprene, polyacrylates, buna S, and fluorosilicones.

8. An array hybridization apparatus as recited in claim 1, wherein the standoff is between 40 to 1000 microns in height.

9. A method of aligning an array hybridization apparatus comprising:

(a) providing a first substrate, second substrate and at least 2 standoffs; and

(b) contacting the first substrate to the standoff to align the array hybridization apparatus.

10. A method of making an array hybridization apparatus with a standoff for alignment, comprising:

(a) providing a first substrate opposite a second substrate;

(b) interposing a standoff between a first substrate and a second substrate;

(c) contacting the first substrate and second substrate to the standoff.

11. A method of making an array hybridization apparatus for aligning a gasket, comprising:

(a) providing a first substrate;

(b) attaching at least two standoffs to the first substrate;

(c) using the standoff to align at least one gasket on the first substrate using the standoff and the gasket.