Electromagnetic-wave shielding and light transmitting plate and manufacturing method thereof

• US 20040214502A1
• Filed: 05/19/2004
• Published: 10/28/2004
• Est. Priority Date: 11/20/2001
• Status: Active Grant

• Current Assignee: Bridgestone Corporation
• Original Assignee: Bridgestone Corporation
• Inventors: Kotsubo, Hidefumi, Tanuma, Itsuo, Morimura, Yasuhiro
• Granted Patent: US 7,560,135 B2
• Time in Patent Office: Days
• US Class Current: 445/49
• CPC Class Codes: H05K 9/0096 for television displays, e.g. plasma display panel

Abstract

To manufacture an electromagnetic-wave shielding and light transmitting plate having a conductive pattern of which line width is narrow and open area ratio is high, a negative pattern 2 composed of dots is printed on a transparent film 1 having a high affinity for a plated layer of a conductive material by using a transparent resin having a low affinity for the plated layer and a backside coating layer 3 is formed by printing a transparent resin on the entire back surface of the transparent film 1. Then, a conductive material layer is formed by electroless plating to cover the film exposed surface not covered by the negative pattern 2 of the film 1, thereby forming the conductive pattern 4. After that, the blackening treatment is conducted, thereby obtaining the electromagnetic-wave shielding and light transmitting plate.

Claims

1. A method of manufacturing an electromagnetic-wave shielding and light transmitting plate comprising a transparent film and a conductive pattern made of a conductive material, wherein the conductive pattern is formed on a surface of the transparent film by plating, the method comprising:

a step of forming a negative pattern to be an opposite pattern of said conductive pattern, wherein the negative pattern is formed on the surface of the transparent film having a relatively high affinity for the plated layer by using a transparent resin having a relatively low affinity for the plated layer, and

a step of forming said conductive pattern by subjecting the transparent film to plating treatment with plating solution after the formation of the negative pattern so as to attach the conductive material only to the surface of the transparent film not covered by the negative pattern.

2. A method of manufacturing an electromagnetic-wave shielding and light transmitting plate as claimed in claim 1, wherein said plating treatment is conducted after coating the entire back surface of the transparent film with a backside coating layer made of a material having a relatively low affinity for said plating.

3. A method of manufacturing an electromagnetic-wave shielding and light transmitting plate as claimed in claim 2, wherein said backside coating layer is made of said transparent resin.

4. A method of manufacturing an electromagnetic-wave shielding and light transmitting plate as claimed in claim 2, wherein said backside coating layer is removed after the plating treatment.

5. A method of manufacturing an electromagnetic-wave shielding and light transmitting plate as claimed in claim 1, wherein after said conductive pattern is formed, said conductive pattern is subjected to blackening treatment.

6. A method of manufacturing an electromagnetic-wave shielding and light transmitting plate as claimed in claim 1, wherein said transparent film is made of one or more selected from a group consisting of ABM, MBS, triacetylcellulose, PET, PBT, PEN, PC/ABS alloy, and polypropylene.

7. A method of manufacturing an electromagnetic-wave shielding and light transmitting plate as claimed in claim 1, wherein said transparent resin is a resin mainly containing acrylic polymer.

8. A method of manufacturing an electromagnetic-wave shielding and light transmitting plate as claimed in claim 1, wherein said conductive material contains at least one of a group consisting of copper, nickel, chromium, zinc, tin, silver, and gold.

9. A method of manufacturing an electromagnetic-wave shielding and light transmitting plate as claimed in claim 1, wherein said negative pattern is composed of dots.

10. A method of manufacturing an electromagnetic-wave shielding and light transmitting plate as claimed in claim 1, wherein said negative pattern is formed by means of printing.

14. A method of manufacturing an electromagnetic-wave shielding and light transmitting plate as claimed in claim 3, wherein said backside coating layer is removed after the plating treatment.

11. An electromagnetic-wave shielding and light transmitting plate comprising a transparent film, a conductive pattern formed on a surface of the transparent film, and a transparent resin layer coating the surface of the transparent film not covered by said conductive pattern.

12. An electromagnetic-wave shielding and light transmitting plate as claimed in claim 11, wherein the line width of said pattern is 200 μ

m or less and the open area ratio is 75% or more.

13. An electromagnetic-wave shielding and light transmitting plate as claimed in claim 11, wherein the electromagnetic-wave shielding and light transmitting plate is manufactured by the method comprising:

a step of forming a negative pattern to be an opposite pattern of said conductive pattern wherein the negative pattern is formed on the surface of the transparent film having a relatively high affinity for the plated layer by using a transparent resin having a relatively low affinity for the plated layer, and

a step of forming said conductive pattern by subjecting the transparent film to plating treatment with plating solution after the formation of the negative pattern so as to attach the conductive material only to the surface of the transparent film not covered by the negative pattern.

15. An electromagnetic-wave shielding and light transmitting plate as claimed in claim 12, wherein the electromagnetic-wave shielding and light transmitting plate is manufactured by the method comprising:

a step of forming a negative pattern to be an opposite pattern of said conductive pattern, wherein the negative pattern is formed on the surface of the transparent film having a relatively high affinity for the plated layer by using a transparent resin having a relatively low affinity for the plated layer, and

a step of forming said conductive pattern by subjecting the transparent film to plating treatment with plating solution after the formation of the negative pattern so as to attach the conductive material only to the surface of the transparent film not covered by the negative pattern.