Integrated circuit device packaging structure and packaging method
First Claim
Patent Images
1. A packaging structure of an integrated circuit device having a photo detecting part, comprising:
- a substrate placed on the photo detecting part side of the integrated circuit device, the substrate being provided with at least one lead, at least one of the lead being electrically connected with the integrated circuit device via an electrode; and
an encapsulation section for encapsulating the integrated circuit device and the substrate, wherein the substrate has an opening formed above the photo detecting part.
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Abstract
A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.
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Citations
31 Claims
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1. A packaging structure of an integrated circuit device having a photo detecting part, comprising:
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a substrate placed on the photo detecting part side of the integrated circuit device, the substrate being provided with at least one lead, at least one of the lead being electrically connected with the integrated circuit device via an electrode; and
an encapsulation section for encapsulating the integrated circuit device and the substrate, wherein the substrate has an opening formed above the photo detecting part. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A packaging method for an integrated circuit device having a photo detecting part, the method comprising the steps of
(1) forming the integrated circuit device; -
(2) forming a substrate having at least one lead and an opening;
(3) placing the substrate on the photo detecting part side of the integrated circuit device so that the opening is located above the photo detecting part, and electrically connecting the integrated circuit device with at least one of the lead of the substrate via an electrode; and
(4) encapsulating the substrate and the integrated circuit device, wherein in the step (1), the position of the electrode is determined based on positional relationships between the photo detecting part and the electrode standardized for a plurality of types of integrated circuit devices.
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28. A packaging structure of an integrated circuit device, comprising:
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a substrate placed on the principal surface side of the integrated circuit device, the substrate being provided with at least one lead, at least one of the lead being electrically connected with the integrated circuit device via an electrode; and
an encapsulation section for encapsulating the integrated circuit device and the substrate, wherein the substrate is provided with a bypass capacitor. - View Dependent Claims (29, 30, 31)
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Specification