Integrated circuit device packaging structure and packaging method

• US 20040217363A1
• Filed: 05/10/2004
• Published: 11/04/2004
• Est. Priority Date: 04/18/2002
• Status: Abandoned Application

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Taniguchi, Masaki, Shimizu, Yuzo, Fukuda, Hideo, Esaki, Shinya, Shirakawa, Yasufumi
• Application Number:
  US10/841,566
• Publication Number:
  US 20040217363A1
• Time in Patent Office: Days
• US Class Current: 257/81
• CPC Class Codes: G11B 7/13 Optical detectors therefor
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device

Abstract

A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead is electrically connected with the integrated circuit device via an electrode. The integrated circuit device and the substrate are encapsulated with an encapsulation section. The substrate has an opening at a position above the photo detecting part.

Claims

1. A packaging structure of an integrated circuit device having a photo detecting part, comprising:

a substrate placed on the photo detecting part side of the integrated circuit device, the substrate being provided with at least one lead, at least one of the lead being electrically connected with the integrated circuit device via an electrode; and

an encapsulation section for encapsulating the integrated circuit device and the substrate,

wherein the substrate has an opening formed above the photo detecting part.

2. The structure of claim 1, wherein the substrate is provided with a bypass capacitor.

3. The structure of claim 2, wherein the bypass capacitor is formed on a surface of the substrate.

4. The structure of claim 2, wherein the bypass capacitor is formed in a surface portion of the substrate.

5. The structure of claim 2, wherein the bypass capacitor is formed to be in contact with two leads for which bypassing is performed.

6. The structure of claim 1, wherein an optical component is placed in the opening of the substrate.

7. The structure of claim 6, wherein the optical component is a hologram device, a wavelength selective filter or a lens.

8. The structure of claim 6, wherein the optical component is secured in the opening of the substrate with a screw structure.

9. The structure of claim 6, wherein the optical component is secured in the opening of the substrate with a bonding member.

10. The structure of claim 1, wherein the opening of the substrate is provided with a shutter that can be opened/closed and blocks light incident on the photo detecting part in its closed state.

11. The structure of claim 10, wherein the shutter is formed of a liquid crystal material.

12. The structure of claim 1, wherein the integrated circuit device has a light emitting part on the side of its light receiving surface.

13. The structure of claim 12, wherein the light emitting part is a laser device.

14. The structure of claim 12, wherein the substrate has a second opening formed above the light emitting part.

15. The structure of claim 14, wherein the second opening is provided with a shutter that can be opened/closed and blocks light emitted from the light emitting part in its closed state.

16. The structure of claim 15, wherein the shutter is formed of a liquid crystal material.

17. The structure of claim 1, wherein at least part of the back surface of the integrated circuit device is exposed from the encapsulation section.

18. The structure of claim 1, wherein a heat dissipating member is placed on the back surface side of the integrated circuit device to be in contact with the integrated circuit device and is encapsulated with the encapsulation section together with the integrated circuit device.

19. The structure of claim 18, wherein at least part of the heat dissipating member is exposed from the encapsulation section.

20. The structure of claim 1, wherein a second integrated circuit device is placed on the back surface side of the integrated circuit device to be integral with the integrated circuit device and is encapsulated with the encapsulation section together with the integrated circuit device.

21. The structure of claim 20, wherein a heat dissipating member is interposed between the integrated circuit device and the second integrated circuit device, and at least part of the heat dissipating member is exposed from the encapsulation section.

22. The structure of claim 1, wherein a hollow defined by the encapsulation section as a side wall is formed between the substrate and the integrated circuit, and

the encapsulation section has a through hole formed to allow the hollow to communicate with the outside of the packaging structure.

23. The structure of claim 22, wherein the axis of the through hole is approximately parallel to the movement direction of a pickup when the packaging structure is used as the pickup.

24. The structure of claim 1, wherein at least part of the surface of the substrate on the side of the integrated circuit device is subjected to antireflection treatment.

25. The structure of claim 24, wherein antireflection coating is performed as the antireflection treatment.

26. The structure of claim 24, wherein satin finish is performed as the antireflection treatment.

27. A packaging method for an integrated circuit device having a photo detecting part, the method comprising the steps of

(1) forming the integrated circuit device;

(2) forming a substrate having at least one lead and an opening;

(3) placing the substrate on the photo detecting part side of the integrated circuit device so that the opening is located above the photo detecting part, and electrically connecting the integrated circuit device with at least one of the lead of the substrate via an electrode; and

(4) encapsulating the substrate and the integrated circuit device, wherein in the step (1), the position of the electrode is determined based on positional relationships between the photo detecting part and the electrode standardized for a plurality of types of integrated circuit devices.

28. A packaging structure of an integrated circuit device, comprising:

a substrate placed on the principal surface side of the integrated circuit device, the substrate being provided with at least one lead, at least one of the lead being electrically connected with the integrated circuit device via an electrode; and

an encapsulation section for encapsulating the integrated circuit device and the substrate,

wherein the substrate is provided with a bypass capacitor.

29. The structure of claim 28, wherein the bypass capacitor is formed on a surface of the substrate.

30. The structure of claim 28, wherein the bypass capacitor is formed in a surface portion of the substrate.

31. The structure of claim 28, wherein the bypass capacitor is formed to be in contact with two leads for which bypassing is performed.