Area efficient stacking of antifuses in semiconductor device
First Claim
1. Apparatus comprising:
- a semiconductor body having on a surface thereof at least one lower antifuse and at least one upper antifuse in vertically stacked relation with both such antifuses sharing a common intermediate electrode therebetween;
the lower antifuse having a lower counter electrode and a lower fusible insulator portion defining a lower fuse element of an initial high electrical resistance state interconnecting the lower counter electrode with the common intermediate electrode; and
the upper antifuse having an upper counter electrode and an upper fusible insulator portion defining an upper fuse element of an initial high electrical resistance state interconnecting the upper counter electrode with the common intermediate electrode;
the upper and lower antifuses being arranged to permit their respective selective energizing for corresponding separate or simultaneous activation to a final low electrical resistance state.
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Accused Products
Abstract
A semiconductor device is provided which is formed of a wafer having on a surface thereof an area efficient arrangement of at least two antifuses in vertically stacked relation and sharing a common intermediate electrode therebetween. The arrangement includes at least one lower antifuse having a lower counter electrode and a lower fusible insulator portion defining a lower fuse element of an initial high electrical resistance state which interconnects the lower counter electrode with the common intermediate electrode, and at least one upper antifuse, which may be the same as or different from the lower antifuse, the upper antifuse having an upper counter electrode and an upper fusible insulator portion defining an upper fuse element of an initial high electrical resistance state which interconnects the upper counter electrode with the common intermediate electrode.
67 Citations
27 Claims
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1. Apparatus comprising:
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a semiconductor body having on a surface thereof at least one lower antifuse and at least one upper antifuse in vertically stacked relation with both such antifuses sharing a common intermediate electrode therebetween;
the lower antifuse having a lower counter electrode and a lower fusible insulator portion defining a lower fuse element of an initial high electrical resistance state interconnecting the lower counter electrode with the common intermediate electrode; and
the upper antifuse having an upper counter electrode and an upper fusible insulator portion defining an upper fuse element of an initial high electrical resistance state interconnecting the upper counter electrode with the common intermediate electrode;
the upper and lower antifuses being arranged to permit their respective selective energizing for corresponding separate or simultaneous activation to a final low electrical resistance state. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A semiconductor device comprising:
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a wafer having on a surface thereof an arrangement of at least one lower antifuse and at least one upper antifuse in vertically stacked relation and both such antifuses sharing a common intermediate electrode therebetween;
the lower antifuse having a lower counter electrode and a lower fusible insulator portion defining a lower fuse element of an initial high electrical resistance state interconnecting the lower counter electrode with the common intermediate electrode; and
the upper antifuse having an upper counter electrode and an upper fusible insulator portion defining an upper fuse element of an initial high electrical resistance state interconnecting the upper counter electrode with the common intermediate electrode;
the upper and lower antifuses being arranged to permit their respective selective energizing for corresponding separate or simultaneous activation to a final low electrical resistance state;
wherein at least one of the antifuses is provided redundantly with at least one additional antifuse in closely laterally adjacent arrangement thereto and having an additional counter electrode and an additional fusible insulator portion defining an additional fuse element of an initial high electrical resistance state interconnecting the additional counter electrode with the common intermediate electrode; and
wherein the counter electrode of at least one of the antifuses is interconnected by the corresponding fuse element to the common intermediate electrode through at least one electrode extension portion interposed between said fuse element and the common intermediate electrode.
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22. A semiconductor device comprising:
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a wafer having on a surface thereof an arrangement of at least one lower antifuse and at least one upper antifuse in vertically stacked relation and both such antifuses sharing a common intermediate electrode therebetween;
the lower antifuse having a lower counter electrode and a lower fusible insulator portion defining a lower fuse element of an initial high electrical resistance state interconnecting the lower counter electrode with the common intermediate electrode; and
the upper antifuse having an upper counter electrode and an upper fusible insulator portion defining an upper fuse element of an initial high electrical resistance state interconnecting the upper counter electrode with the common intermediate electrode;
the upper and lower antifuses being arranged to permit their respective selective energizing for corresponding separate or simultaneous activation to a final low electrical resistance state;
wherein at least one of the antifuses is provided redundantly with at least one additional antifuse in closely laterally adjacent arrangement thereto and having an additional counter electrode and an additional fusible insulator portion defining an additional fuse element of an initial high electrical resistance state interconnecting the additional counter electrode with the common intermediate electrode; and
wherein the counter electrode of at least one of the antifuses is interconnected by the corresponding fuse element to the common intermediate electrode through at least one electrode extension portion interposed between said fuse element and the corresponding counter electrode.
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23. A semiconductor device comprising:
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a wafer having on a surface thereof an arrangement of at least one lower antifuse and at least one upper antifuse in vertically stacked relation and both such antifuses sharing a common intermediate electrode therebetween;
the lower antifuse having a lower counter electrode and a lower fusible insulator portion defining a lower fuse element of an initial high electrical resistance state interconnecting the lower counter electrode with the common intermediate electrode; and
the upper antifuse having an upper counter electrode and an upper fusible insulator portion defining an upper fuse element of an initial high electrical resistance state interconnecting the upper counter electrode with the common intermediate electrode;
the upper and lower antifuses being arranged to permit their respective selective energizing for corresponding separate or simultaneous activation to a final low electrical resistance state;
wherein the lower antifuse is provided redundantly with at least one additional lower antifuse in closely laterally adjacent arrangement thereto and connected in parallel therewith and having an additional lower counter electrode and an additional lower fusible insulator portion defining an additional lower fuse element of an initial high electrical resistance state interconnecting the additional lower counter electrode with the common intermediate electrode;
wherein the upper antifuse is provided redundantly with at least one additional upper antifuse in closely laterally adjacent arrangement thereto and connected in parallel therewith and having an additional upper counter electrode and an additional upper fusible insulator portion defining an additional upper fuse element of an initial high electrical resistance state interconnecting the additional upper counter electrode with the common intermediate electrode; and
wherein the counter electrode of at least one of the antifuses is interconnected by the corresponding fuse element to the common intermediate electrode through at least one electrode extension portion interposed between said fuse element and the common intermediate electrode.
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24. A semiconductor device comprising:
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a wafer having on a surface thereof an arrangement of at least one lower antifuse and at least one upper antifuse in vertically stacked relation and both such antifuses sharing a common intermediate electrode therebetween;
the lower antifuse having a lower counter electrode and a lower fusible insulator portion defining a lower fuse element of an initial high electrical resistance state interconnecting the lower counter electrode with the common intermediate electrode; and
the upper antifuse having an upper counter electrode and an upper fusible insulator portion defining an upper fuse element of an initial high electrical resistance state interconnecting the upper counter electrode with the common intermediate electrode;
the upper and lower antifuses being arranged to permit their respective selective energizing for corresponding separate or simultaneous activation to a final low electrical resistance state;
wherein the lower antifuse is provided redundantly with at least one additional lower antifuse in closely laterally adjacent arrangement thereto and connected in parallel therewith and having an additional lower counter electrode and an additional lower fusible insulator portion defining an additional lower fuse element of an initial high electrical resistance state interconnecting the additional lower counter electrode with the common intermediate electrode;
wherein the upper antifuse is provided redundantly with at least one additional upper antifuse in closely laterally adjacent arrangement thereto and connected in parallel therewith and having an additional upper counter electrode and an additional upper fusible insulator portion defining an additional upper fuse element of an initial high electrical resistance state interconnecting the additional upper counter electrode with the common intermediate electrode; and
wherein the counter electrode of at least one of the antifuses is interconnected by the corresponding fuse element to the common intermediate electrode through at least one electrode extension portion interposed between said fuse element and the corresponding counter electrode.
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25. A semiconductor device comprising:
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a wafer having on a surface thereof an arrangement of a plurality of lower antifuses and a plurality of upper antifuses in vertically stacked relation and sharing a common intermediate electrode therebetween;
the plurality of lower antifuses being in closely laterally adjacent side by side arrangement, each lower antifuse having a lower counter electrode and a lower fusible insulator portion defining a lower fuse element of an initial high electrical resistance state interconnecting the lower counter electrode with the common intermediate electrode, the plurality of lower antifuses being arranged to form a lower bank of antifuses along the common intermediate electrode; and
the plurality of upper antifuses being in closely laterally adjacent side by side arrangement, each upper antifuse having an upper counter electrode and an upper fusible insulator portion defining an upper fuse element of an initial high electrical resistance state interconnecting the upper counter electrode with the common intermediate electrode, the plurality of upper antifuses being arranged to form a corresponding upper bank of antifuses along the common intermediate electrode;
the upper and lower antifuses being arranged to permit their respective selective energizing for corresponding separate or simultaneous activation to a final low electrical resistance state. - View Dependent Claims (26, 27)
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Specification