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Area efficient stacking of antifuses in semiconductor device

  • US 20040217441A1
  • Filed: 12/28/2000
  • Published: 11/04/2004
  • Est. Priority Date: 12/28/2000
  • Status: Active Grant
First Claim
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1. Apparatus comprising:

  • a semiconductor body having on a surface thereof at least one lower antifuse and at least one upper antifuse in vertically stacked relation with both such antifuses sharing a common intermediate electrode therebetween;

    the lower antifuse having a lower counter electrode and a lower fusible insulator portion defining a lower fuse element of an initial high electrical resistance state interconnecting the lower counter electrode with the common intermediate electrode; and

    the upper antifuse having an upper counter electrode and an upper fusible insulator portion defining an upper fuse element of an initial high electrical resistance state interconnecting the upper counter electrode with the common intermediate electrode;

    the upper and lower antifuses being arranged to permit their respective selective energizing for corresponding separate or simultaneous activation to a final low electrical resistance state.

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