RF multilayer circuit board

• US 20040217830A1
• Filed: 02/10/2004
• Published: 11/04/2004
• Est. Priority Date: 02/13/2003
• Status: Abandoned Application

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Schneider, Martin, Hansen, Thomas, Brueggemann, Oliver
• Application Number:
  US10/776,147
• Publication Number:
  US 20040217830A1
• Time in Patent Office: Days
• US Class Current: 333/246
• CPC Class Codes: H01P 1/047 Strip line joints
• CPC Class Codes: H05K 1/0222 for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/09618 Via fence, i.e. one-dimensional array of vias
• CPC Class Codes: H05K 2201/09718 Clearance holes
• CPC Class Codes: H05K 2201/09809 Coaxial layout
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

An RF multilayer circuit board having: a first conductive device in a first plane for providing a first RF signal line; a first reference potential plane in a second plane for providing a reference potential of the first RF signal line; at least one second reference potential plane in a third plane for providing a reference potential of an at least one second RF signal line; at least one second conductive device in a fourth plane for providing a second RF signal line; a plated through hole device for electrically connecting the first and second conductive devices, the first and second reference potential planes each having a recess between them in the area of the plated through hole device; and at least one additional conductive device in the area of the plated through hole device at least between the first and second reference potential planes and bonding them in order to provide a waveguiding channel around the plated through hole device.

Claims

1. An RF multilayer circuit board comprising:

a first conductive device in a first plane for providing a first RF signal line;

a first reference potential plane in a second plane for providing a reference potential of the first RF signal line;

at least one second reference potential plane in a third plane for providing a reference potential of an at least second RF signal line;

at least one second conductive device in a fourth plane for providing a second RF signal line;

a plated through hole device for electrically connecting the first and second conductive devices, the first and second reference potential planes between them each having a recess in an area of the plated through hole device; and

at least one additional conductive device in the area of the plated through hole device at least between the first and second reference potential planes and bonding them in order to provide a waveguiding channel around the plated through hole device.

2. The RF multilayer circuit board according to claim 1, wherein the additional conductive device extends between the first and fourth planes in the area of the plated through hole device.

3. The RF multilayer circuit board according to claim 1, wherein, in the area of the plated through hole device, the additional conductive device has a plurality of cylindrical, conductive vias that are substantially coaxial to the plated through hole device, the vias forming a semicircle of at least one row.

4. The RF multilayer circuit board according to claim 1, further comprising a dielectric material that stiffens the circuit board and is situated in a gap space between the first and second reference potential planes, the dielectric material having a dielectric constant ε

_r, which corresponds to that of a softboard material in an area of at least one of the first and fourth planes.

5. The RF multilayer circuit board according to claim 1, wherein situated between the first and second reference potential planes are a plurality of reference potential planes which have recesses of varying size in the area of the plated through hole device.

6. The RF multilayer circuit board according to claim 1, wherein the additional conductive device in the area of the plated through hole device has a plurality of cylindrical vias that form a ring around the plated through hole device.

7. The RF multilayer circuit board according to claim 1, wherein a recess filled with a dielectric is situated at least between the first and second reference potential planes in the area of the plated through hole device, a wall have a conductive material in an area of the recess and forming the additional conductive device in the area of the plated through hole device.

8. The RF multilayer circuit board according to claim 1, wherein a metal-plated, tubular device forms the additional conductive device in the area of the plated through hole device.

9. The RF multilayer circuit board according to claim 1, wherein a material having a low loss factor at high frequencies is situated in the area of the additional conductive device in the area of the plated through hole device.