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Thermal interface adapter plate conversion kit and method

  • US 20040218375A1
  • Filed: 05/02/2003
  • Published: 11/04/2004
  • Est. Priority Date: 05/02/2003
  • Status: Active Grant
First Claim
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1. A method of selectively assembling a module as either an open frame module or a baseplate module from a printed circuit board (PCB) having an electric circuit thereon and mounting fixtures, said method comprising:

  • selecting a PCB;

    determining whether the type of module to be assembled is to be said open frame module or said baseplate module;

    selecting mounting fixtures according to said type of module selected; and

    attaching said selected mounting fixtures to said selected PCB.

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