Thermal interface adapter plate conversion kit and method

• US 20040218375A1
• Filed: 05/02/2003
• Published: 11/04/2004
• Est. Priority Date: 05/02/2003
• Status: Active Grant

• Current Assignee: Astec International Limited (Emerson Electric Company)
• Original Assignee: Astec International Limited (Emerson Electric Company)
• Inventors: Fronk, Karl T.
• Granted Patent: US 7,200,011 B2
• Time in Patent Office: Days
• US Class Current: 361/813
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

The present invention provides a method of assembling a printed circuit board (PCB) module intended for attachment to another structure, such as another larger PCB. In particular, the invention provides a plurality of different mounting fixtures for a PCB for enabling the selective enhancement of the thermal characteristics of the module. One embodiment of the invention provides a module comprising a PCB having a circuit mounted thereon and fixtures that, when attached to the PCB, result in an open frame or a baseplate module. A preferred circuit for said inventive assembly is a power conversion module designed to be mounted on another PCB that requires such power conversion in close proximity to the circuit components on the other board. The manufacturer of such power conversion or other modules can thus manufacture and pretest the board'"'"'s electronics before assembly into either an open frame or baseplate module, while also providing inexpensive mounting fixtures to enable a user to select the type of heat dissipation provided by the module.

Claims

1. A method of selectively assembling a module as either an open frame module or a baseplate module from a printed circuit board (PCB) having an electric circuit thereon and mounting fixtures, said method comprising:

selecting a PCB;

determining whether the type of module to be assembled is to be said open frame module or said baseplate module;

selecting mounting fixtures according to said type of module selected; and

attaching said selected mounting fixtures to said selected PCB.

2. The method of claim 1, wherein said PCB circuit is a power converter.

3. The method of claim 1, wherein said mounting fixtures for said open frame module include at least one lead frame including snap fit fasteners, and wherein said PCB includes holes formed in a first surface thereof, for enabling the fasteners on each said lead frame to be snap fit in said holes such that each said lead frame is fastened onto a first surface of said PCB.

4. The method of claim 1, wherein said PCB includes a plurality of holes formed therein, and wherein said mounting fixtures for said baseplate module include a baseplate having a plurality of posts extending out from the surface thereof and positioned to fit through said PCB holes, at least one lead frame having holes formed therein, such that at least some of said posts are also enabled to extend therethrough, and a plurality of fasteners;

such that, when assembled using said fasteners, said PCB and at least one lead frame are clamped in place between said baseplate and said fasteners.

5. The method of claim 1, wherein said baseplate includes a plurality of pre-tapped holes;

and wherein said PCB and said at least one lead frame define additional holes that enable said fasteners to extend therethrough during assembly and mate with said pre-tapped holes to provide said clamping.

6. A conversion kit for enabling a user to select between assembling a module as either an open frame module or a baseplate module, said kit comprising:

a printed circuit board (PCB) including an electrical circuit having one or more components mounted on a first surface thereof and having two rows of pins extending out from said first surface proximate to opposite edges of said PCB for enabling said circuit to be connected to a circuit external to said PCB, and including one or more components of said circuit mounted on the opposite surface of said PCB;

two non-conductive lead frames each having a plurality of holes in a position to enable each lead frame to be positioned on the surface of said PCB with each said pin extending through a corresponding hole in one of said lead frames; and

providing

a) open frame mounting hardware for mounting said lead frames to said PCB, and

b) a baseplate and baseplate mounting hardware for attaching said baseplate to said opposite surface of said PCB, said mounting hardware providing selective heat dissipation alternatives for said circuit components and for attaching said lead frames to said PCB.

7. The kit of claim 6, wherein said PCB includes holes formed at each corner thereof, and wherein said open frame mounting hardware comprises means for enabling said lead frames to be snap fit in holes formed in the surface of said PCB.

8. The kit of claim 6, wherein said PCB includes holes formed at each corner thereof;

wherein said baseplate mounting hardware comprises posts positioned at each corner of said baseplate that fit through said PCB holes and a plurality of fasteners; and

wherein said lead frames include holes formed in each end thereof such that two of said posts are also enabled to extend through each said lead frame, such that, when assembled using said fasteners, said PCB and lead frames are clamped in place between said baseplate and said fasteners.

9. The kit of claim 8, wherein said baseplate includes a plurality of pre-tapped holes;

and wherein said PCB and said lead frames include additional holes formed therein to enable said fasteners to extend through said holes during assembly and mate with said pre-tapped holes to provide said clamping.

10. The kit of claim 8, wherein said posts are sized such that, when said baseplate is mounted on said PCB, said posts provide a predetermined amount of spacing between said first surface of said PCB and the surface of a structure on which the assembled PCB is to be installed.

11. The kit of claim 10, wherein said posts are pre-tapped to enable fasteners to secure said PCB to the surface of said structure.

12. The kit of claim 6, wherein said lead frames are sized such that, when said lead frames are mounted on said PCB, said lead frames provide a predetermined amount of spacing between said first surface of said PCB and the surface of a structure on which the assembled PCB is to be installed.

13. The kit of claim 12, wherein said lead frames include pre-tapped holes to enable fasteners to secure said PCB to the surface of a structure on which the assembled PCB is to be installed.

14. The kit of claim 6, wherein said PCB circuit is a power converter, and wherein said one or more components on the opposite side of said PCB comprise power components.