Heat-reduction methods and systems related to microfluidic devices
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Accused Products
Abstract
A system and method for preventing or reducing unwanted heat in a microfluidic of the device while generating heat in selected regions of the device.
In one example, current is supplied to a heating element through electric leads, wherein the leads are designed so that the current density in the leads is substantially lower than the current density in the heating element. This may be accomplished using conductive leads which have a cross-sectional area which is substantially greater than the cross-sectional area of the heating element.
In another example, unwanted heat in the microfluidic complex is reduced by thermally isolating the electric leads from the microfluidic complex. This may be accomplished by running each lead directly away from the microfluidic complex, through a thermally isolating substrate. After the leads pass through the thermally isolating substrate, they are then routed to the current source. Thus, the thermally isolating substrate substantially blocks the transfer of heat from the leads to the microfluidic complex.
In another example, unwanted heat is removed from selected regions of the microfluidic complex using one or more cooling devices. One or more Peltier cooling devices may be attached to a substrate to remove heat generated by heating elements and/or other electronic circuitry.
175 Citations
39 Claims
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1-17. -17. (Canceled).
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18. An integrated microfluidic system comprising a microfluidic device, the system comprising:
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a first substrate having a first side;
a second substrate having a first side and an opposing second side;
a third substrate having a first side;
wherein (a) the respective first sides of the first and second substrates abut one another and (b) the second side of the second substrate and the first side of the third substrate abut one another and further wherein the respective first sides of the first and second substrates comprise therebetween a microfluidic complex having a heating region, the heating region including a heating surface;
a heating element between the first side of the second substrate and the second side of the second substrate and separated from fluid present within the heating region by a portion of the second substrate, the heating element configured to provide heat to the heating region through the heating surface; and
a conductive lead for supplying electric current from a current source to the heating element, the conductive lead being substantially more conductive than the heating element so as to reduce heat emitted by the conductive lead. - View Dependent Claims (19, 20)
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21. A device for microfluidic processing, comprising:
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a first substrate comprising a first side;
a second substrate comprising first and second sides, the first side of the second substrate comprising a oxide layer having a first side, the first side of the oxide layer affixed to the first substrate, the first side of the oxide layer and the first side of the first substrate comprising therebetween a microfluidic complex;
a heating element lying within the oxide layer, for heating a selected region of the complex, the heating element being separated by at least a portion of the oxide layer from fluid present with the selected region; and
a conductive lead for supplying electric current to the heating element, the conductive lead having a first end connected to the heating element and a second end for connection to a current source, the conductive lead being substantially thicker than the heating element so as to reduce heat emitted from the conductive lead. - View Dependent Claims (22, 23)
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24. A microfluidic device comprising:
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a microfluidic complex having a thermally actuated component;
a thermally isolating layer having a low thermal conductivity, a heating element, positioned in thermal contact with the thermally actuated component and intermediate the thermally actuated component and the thermally isolating layer; and
a conductive lead for supplying electric current from a current source to the heating element, the conductive lead spaced apart from the microfluidic complex by the thermally isolating layer.
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25. An integrated microfluidic system comprising a microfluidic device, the system comprising:
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a first substrate comprising a first side;
a second substrate comprising first and second sides, the first side of the second substrate abutting the first side of the first substrate, wherein the respective first sides of the first and second substrates define a microfluidic complex therebetween;
a third substrate comprising first and second sides, the first side of the third substrate abutting the second side of the second substrate;
a heating element configured to heat a selected region of the complex;
a first conductive lead extending from a first location spaced apart laterally from the heating element to a second location located closer to the heating element than the first location, the first conductive lead being separated from the first side of the first substrate by the second substrate; and
a second conductive lead connecting the heating element to the first conductive lead, wherein the second conductive lead is routed through at least the second side of the third substrate. - View Dependent Claims (26, 27, 28, 29)
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30. An integrated microfluidic system, comprising:
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a first substrate comprising a first side;
a second substrate comprising first and second opposed sides, wherein the respective first sides of the first and second substrates define a microfluidic complex therebetween, the microfluidic complex comprising a chamber having an inner surface;
a heating element configured to heat the inner surface of the chamber, the heating element spaced apart from the inner surface by the first side of the second substrate;
a first conductive lead extending from a first location spaced apart laterally from the heating element to a second location located closer to the heating element than the first location, the first conductive lead being spaced apart from the first side of the first substrate by the second side of the second substrate; and
a second conductive lead connecting the heating element and the first conductive lead, wherein the second conductive lead extends through the second side of the second substrate. - View Dependent Claims (31, 32, 33)
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34. An integrated microfluidic system comprising a microfluidic device, the system comprising:
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first and second substrates defining, therebetween, a microfluidic complex;
a heating element configured to heat a portion of the microfluidic complex;
a conductor in electrical communication with the heating element; and
a third substrate abutting one of the first and second substrates and separating at least a portion of the conductor and heating element. - View Dependent Claims (35, 36)
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37. An integrated microfluidic system comprising a microfluidic device, the system comprising:
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a microfluidic complex comprising a thermally actuated component;
a heating element configured to actuate the thermally actuated component;
a conductor in electrical communication with the heating element; and
a substrate disposed between at least a portion of the conductor and heating element. - View Dependent Claims (38, 39)
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Specification