Vacuum package fabrication of integrated circuit components
3 Assignments
0 Petitions
Accused Products
Abstract
A method for manufacturing integrated circuit device lids includes creating a lid cavity on the surface of a lid wafer, forming a sealing surface on the lid wafer that surrounds the lid cavity, and forming a trench on the lid wafer between the lid cavity and the sealing surface. The resulting structure uptakes excess sealing surface material and prevents such material from entering the lid cavity.
54 Citations
31 Claims
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1-10. -10. (cancelled)
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11. A lid for an integrated circuit device comprising:
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a lid wafer having a sealing surface;
at least one cavity formed in the lid wafer;
at least one sealing structure disposed around one of the at least one cavities for sealing the lid wafer to a device wafer, each sealing structure including a bonding adhesion structure coupled to the sealing surface of the lid wafer and a bonding layer coupled to the bonding adhesion structure such that the bonding layer is at least substantially separated from the sealing surface of the lid wafer by the bonding adhesion structure;
at least one at least substantially continuous trench formed in the sealing surface of the lid wafer and disposed around the cavity and between the cavity and the sealing structure, the trench being defined in part by a pair of side walls extending at least substantially continuously around the cavity wherein the trench is operable to uptake excess material of the bonding layer and prevent any material of the bonding layer from entering the cavity. - View Dependent Claims (12, 13, 14, 15, 16, 26, 27, 28, 29, 30, 31)
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17. A lid for an integrated circuit device comprising:
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a lid wafer having a sealing surface;
a cavity formed in the lid wafer;
a sealing structure disposed around the cavity for sealing the lid wafer to the device wafer, the sealing structure including a bonding adhesion structure coupled to the sealing surface of the lid wafer and a bonding layer coupled to the bonding adhesion structure such that the bonding layer is at least substantially separated from the sealing surface of the lid wafer by the bonding adhesion structure; and
an at least substantially continuous retaining structure formed in the sealing surface of the lid wafer and disposed around the cavity and between the cavity and the sealing structure for retaining excess material of the bonding layer and preventing the material of the bonding layer from entering the cavity, the retaining structure being defined in part by a pair of side walls extending at least substantially continuously around the cavity.
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18. (Cancelled)
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19. A lid for an integrated circuit device, comprising:
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a lid wafer, having one or more lid cavities on the surface thereof;
one or more sealing surfaces on the lid wafer disposed around the one or more cavities; and
at least one sealing structure disposed around one of the one or more lid cavities for sealing the lid wafer to a device wafer, each sealing structure including a bonding adhesion structure coupled to the sealing surface and a bonding layer coupled to the bonding adhesion structure such that the bonding layer is at least substantially separated from the sealing surface by the bonding adhesion structure;
wherein the lid wafer has one or more at least substantially continuous trenches formed therein, and wherein each trench is disposed around one of the lid cavities and between that lid cavity and one of the sealing surfaces, each trench being defined in part by a pair of side walls extending at least substantially continuously around its respective lid cavity. - View Dependent Claims (20, 22, 23, 24, 25)
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21. (Cancelled)
Specification