Physical vapor deposition components and methods of formation
First Claim
1. A physical vapor deposition (PVD) component forming method comprising inducing a sufficient amount of stress in the component to increase magnetic pass through flux exhibited by the component compared to pass through flux exhibited prior to inducing the stress.
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Abstract
A PVD component forming method includes inducing a sufficient amount of stress in the component to increase magnetic pass through flux exhibited by the component compared to pass through flux exhibited prior to inducing the stress. The method may further include orienting a majority crystallographic structure of the component at (200) prior to inducing the stress, wherein the induced stress alone is not sufficient to substantially alter surface grain appearance. Orienting structure may include first cold working a component blank to at least about an 80% reduction in cross-sectional area. The cold worked component blank can be heat treated at least at about a minimum recrystallization temperature of the component blank. Inducing stress may include second cold work to a reduction in cross-sectional area between about 5% to about 15% of the heat treated component. At least one of the first and second cold working can be unidirectional.
21 Citations
27 Claims
- 1. A physical vapor deposition (PVD) component forming method comprising inducing a sufficient amount of stress in the component to increase magnetic pass through flux exhibited by the component compared to pass through flux exhibited prior to inducing the stress.
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10. A PVD component forming method comprising:
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first cold working a component blank to at least about an 80% reduction in cross-sectional area;
heat treating the cold worked component blank at least at about a minimum recrystallization temperature of the component blank; and
second cold working the heat treated component blank to a reduction in cross-sectional area between about 5% to about 15% of the heat treated component. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A sputter component forming method comprising:
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unidirectionally first cold working a component blank to at least about an 80% reduction in cross-sectional area;
heat treating the cold worked component blank at least at about a minimum recrystallization temperature of the component blank; and
inducing a sufficient amount of stress in the heat treated component to increase magnetic pass through flux exhibited by the heat treated component compared to pass through flux exhibited prior to inducing the stress. - View Dependent Claims (25)
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26. A sputter target forming method comprising:
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unidirectionally first cold rolling a target blank consisting essentially of nickel to at least about an 85% reduction in cross-sectional area;
heat treating the cold rolled target blank at a temperature between about 427°
C. (800°
F.) to about 482°
C. (900°
F.) for less than about 60 minutes; and
second cold rolling the heat treated target blank to a reduction in cross-sectional area of about 10% of the heat treated component, at least about 70% of a surface area at least within selected boundaries of a surface of the second cold rolled target blank exhibiting a (200) texture.
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27. A magnetic flux enhancement method for a sputter component comprising combining unidirectional cold working of a sputter component with heat treatment at least at about a minimum recrystallization temperature and orienting predominate crystallographic structure preferentially at (200) followed by additional unidirectional cold working in a same direction as initially cold worked.
claims 28-33. (canceled).
Specification