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Method and apparatus for manufacturing a device

  • US 20040222349A1
  • Filed: 07/24/2003
  • Published: 11/11/2004
  • Est. Priority Date: 09/29/1999
  • Status: Active Grant
First Claim
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1. A mold assembly comprising:

  • a mold section with a recess defining a mold cavity for receiving a molding material and forming a molded device; and

    a silicon mold member disposed in said mold cavity, said silicon mold member with a mold surface facing said mold cavity, said mold surface having a contoured surface and comprising a plurality of micron or submicron size structural features defining an impression for molding said molded device.

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