LIGHT EMITTING DIODE MODULE DEVICE

• US 20040222427A1
• Filed: 05/07/2003
• Published: 11/11/2004
• Est. Priority Date: 05/07/2003
• Status: Active Grant

• Current Assignee: Bear Hsiung
• Original Assignee: Bear Hsiung
• Inventors: Hsiung, Bear
• Granted Patent: US 6,828,590 B2
• Time in Patent Office: Days
• US Class Current: 257/79
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

An LED module device at least HAS a circuit board, an LED chip and a conductive sheet. The circuit board has a groove. The conductive sheet is made of metal material having good electric and heat conductance effects, and is disposed below the circuit board. The LED chip is received in the groove. The lower side of the LED chip is electrically connected to the upper side of the conductive sheet. The upper side of the LED chip is electrically connected to the upper side of the circuit board with a lead. A gel covers the LED chip. The LED module device has the advantages of high brightness, better heat-radiating efficiency, convenient assembly and simplified fabrication process.

Claims

1. A light emitting diode module device comprising:

a circuit board having a groove;

a conductive sheet disposed below said circuit board; and

a light emitting diode chip received in said groove, a lower side of said light emitting diode chip being electrically connected to an upper side of said conductive sheet, an upper side of said light emitting diode chip being electrically connected with an upper side of said circuit board with a lead, and a gel covering said light emitting diode chip.

2. The light emitting diode module device as claimed in claim 1, wherein the upper side of said circuit board has a cathode circuit, and the upper side of said light emitting diode chip is electrically connected to said cathode circuit on the upper side of said circuit board with said lead.

3. The light emitting diode module device as claimed in claim 1, wherein said conductive sheet is made of metal material of good electric and heat conductance effects.

4. The light emitting diode module device as claimed in claim 1, wherein an area of said conductive sheet is smaller than that of said circuit board to allow the outer edge of said conductive sheet to shrink more inwards than that of said circuit board.

5. The light emitting diode module device as claimed in claim 1, wherein the lower side of said light emitting diode chip is electrically connected with the upper side of said conductive sheet with conducting gel.

6. The light emitting diode module device as claimed in claim 1 further comprising an insulator, a housing and a focusing component, said insulator being disposed below said conducive sheet, a receiving space being formed in said housing, two ends of said receiving space forming a first opening and a second opening, said circuit board, said conductive sheet and said insulator being received in said second opening of said housing, said insulator and said housing being joined together, said circuit board contacting said housing to achieve electric connection, said focusing component being disposed in said receiving space, and a cavity corresponding to said gel and said light emitting diode chip being disposed at a lower side of said focusing component.