Detachable substrate with controlled mechanical hold and method for production thereof

• US 20040222500A1
• Filed: 06/10/2004
• Published: 11/11/2004
• Est. Priority Date: 04/13/2001
• Status: Active Grant

• Current Assignee: Commissariat a L'Energie Atomique (AES Corporation)
• Original Assignee: Commissariat a L'Energie Atomique (AES Corporation)
• Inventors: Aspar, Bernard, Ghyselen, Bruno, Moriceau, Hubert, Rayssac, Olivier
• Granted Patent: US 7,902,038 B2
• Time in Patent Office: Days
• US Class Current: 257/629
• CPC Class Codes: B81C 99/008 separating the processed structure from a mother substrate
• CPC Class Codes: H01L 21/76254 with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
• CPC Class Codes: Y10S 438/958 Passivation layer

Claims