Solid-state imaging device, camera module, and camera-module manufacturing method

• US 20040223072A1
• Filed: 05/06/2004
• Published: 11/11/2004
• Est. Priority Date: 05/08/2003
• Status: Active Grant

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fuji Photo Film Co Limited (Fujifilm Holdings Corporation)
• Inventors: Maeda, Hiroshi, Nishida, Kazuhiro, Shimizu, Shigehisa
• Granted Patent: US 7,570,297 B2
• Time in Patent Office: Days
• US Class Current: 348/340
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A cover glass covers only light-receiving elements formed on a semiconductor substrate of a solid-state imaging device. The other area of the substrate except the light-receiving elements is exposed. An FPC interposed between an optical unit and the solid-state imaging device is formed with an opening for exposing the cover glass and an assembly reference surface of the solid-state imaging device. When the solid-state imaging device is attached to the optical unit, the center of the light-receiving elements is determined as a reference position. The optical unit is directly attached to the assembly reference surface so as to make the reference position coincide with a photographic optical axis of the optical unit.

Claims

1. A solid-state imaging device comprising:

a semiconductor substrate, on a first surface of which light-receiving elements are formed;

a translucent member attached to said first surface, said translucent member covering only the light-receiving elements;

an external connection terminal formed on a second surface of said semiconductor substrate, said second surface being opposite to said first surface; and

a wiring member for electrically connecting said light-receiving element and said external connection terminal.

2. A solid-state imaging device according to claim 1, wherein said wiring member is a through wiring which electrically connects said light-receiving element and said external connection terminal via a through hole formed in said semiconductor substrate.

3. A solid-state imaging device according to claim 1, wherein said wiring member is a surface wiring which passes a side of said semiconductor substrate to electrically connect said light-receiving element and said external connection terminal.

4. A solid-state imaging device according to claim 1, wherein said second surface of said semiconductor substrate has an electronic component mounted thereon for driving said light-receiving element, said electronic component being electrically connected to said wiring member and/or said external connection terminal.

5. A camera module comprising:

a solid-state imaging device including a semiconductor substrate, on a first surface of which light-receiving elements are formed; and

an optical unit having a built-in photographic optical system for forming a subject image on said light-receiving elements,

wherein said first surface of said semiconductor substrate is used as an assembly reference plane when said solid-state imaging device and said optical unit are combined.

6. A camera module according to claim 5, wherein said optical unit is directly attached to said first surface of said semiconductor substrate.

7. A camera module according to claim 5, further comprising:

a translucent member attached to said first surface of said semiconductor substrate, said translucent member covering only the light-receiving elements.

8. A camera module according to claim 7, wherein said optical unit is directly attached to said first surface.

9. A camera module according to claim 8, further comprising:

a circuit board provided with a circuit for driving said solid-state imaging device, said circuit board being interposed between said solid-state imaging device and said optical unit, and said circuit board being electrically connected to said solid-state imaging device; and

an opening formed in said circuit board, said opening exposing said translucent member and said assembly reference plane of said semiconductor substrate.

10. A camera module according to claim 7, wherein said translucent member has flatness being identical with that of said semiconductor substrate.

11. A camera module according to claim 10, wherein said optical unit is attached to said translucent member.

12. A camera module according to claim 5, further comprising:

a circuit board provided with a circuit for driving said solid-state imaging device, said circuit board being interposed between said solid-state imaging device and said optical unit, and said circuit board being electrically connected to said solid-state imaging device; and

an opening formed in said circuit board, said opening exposing a light-receiving area of said light-receiving elements and said assembly reference plane of said semiconductor substrate.

13. A camera module according to claim 5, further comprising:

a circuit board provided with a circuit for driving said solid-state imaging device, said circuit board being attached to a second surface of said semiconductor substrate, which is opposite to said first surface, and said circuit board being electrically connected to said solid-state imaging device.

14. A camera module according to any one of claims 9, 12 and 13, wherein said circuit board is a flexible printed circuit board, which is folded to be disposed under said solid-state imaging device.

15. A camera module according to claim 5, further comprising:

an electronic component for driving said solid-state imaging device, said electronic component being mounted on a second surface of said semiconductor substrate, which is opposite to said first surface, and said electronic component being electrically connected to said solid-state imaging device.

16. A manufacturing method for a camera module including a solid-state imaging device in which light-receiving elements are formed on a semiconductor substrate, and an optical unit having a built-in photographic optical system for forming a subject image on said light-receiving elements, said manufacturing method comprising the steps of:

obtaining image data by imaging said solid-state imaging device with an electronic camera;

determining a first reference position of said solid-state imaging device from said image data;

carrying out positioning on a plane perpendicular to a photographic optical axis of said optical unit so as to make said first reference position coincide with a predetermined second reference position of said optical unit; and

fixing said solid-state imaging device to said optical unit.

17. A manufacturing method for a camera module according to claim 16, wherein said first reference position is located at the center of a light-receiving area of said light-receiving elements.

18. A manufacturing method for a camera module according to claim 17, wherein said second reference position is located at said photographic optical axis of said optical unit.

19. A manufacturing method for a camera module according to claim 16, wherein said solid-state imaging device comprising:

a translucent member attached to a first surface of the semiconductor substrate on which said light-receiving elements are formed, said translucent member covering only the light-receiving elements;

an external connection terminal formed on a second surface of said semiconductor substrate, said second surface being opposite to said first surface; and

a wiring member for electrically connecting said light-receiving element and said external connection terminal.

20. A manufacturing method for a camera module according to claim 19, wherein said first surface of said semiconductor substrate is used as an assembly reference plane when said solid-state imaging device is fixed to said optical unit.

21. A manufacturing method for a camera module according to claim 20, wherein said optical unit is directly attached to said first surface.

22. A manufacturing method for a camera module according to claim 20, wherein said translucent member has flatness being identical with that of said semiconductor substrate.

23. A manufacturing method for a camera module according to claim 22, wherein said optical unit is attached to said translucent member.