AC coupling circuit having a large capacitance and a good frequency response

• US 20040223306A1
• Filed: 02/04/2004
• Published: 11/11/2004
• Est. Priority Date: 02/04/2003
• Status: Active Grant

• Current Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Katsuyama, Tomokazu
• Granted Patent: US 7,196,909 B2
• Time in Patent Office: Days
• US Class Current: 361/738
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2223/665 Bias feed arrangements
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/1903 : including wave guides
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01P 1/047 : Strip line joints
• CPC Class Codes: H01P 1/2007 : Filtering devices for biasing networks or DC returns
• CPC Class Codes: H05K 1/0219 : Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/0231 : Capacitors or dielectric substances
• CPC Class Codes: H05K 2201/1053 : Mounted components directly electrically connected to each other, i.e. not via the PCB
• CPC Class Codes: H05K 2201/10636 : Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2201/10643 : Disc shaped leadless component
• CPC Class Codes: H05K 2203/049 : Wire bonding
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

This invention is directed to reduce degradation, loss, and reflection of high frequency signals of a coupling circuit for an alternating current. The coupling circuit, for connecting a first circuit element to a second circuit element, comprises a die capacitor and a chip capacitor connected in parallel to each other. The die capacitor has a first electrode that faces to and is in contact with the first circuit element, and a second electrode that is wire-bonded to the second circuit element. The chip capacitor also has a first electrode that is in contact with the first circuit element and a second electrode that is in contact with the second electrode of the die capacitor. The coupling circuit may show both advantages of superior performance at high frequencies attributed to the die-capacitor and relative large capacitance attributed to the chip-capacitor.

Claims

1. A coupling circuit for connecting a first circuit element to a second circuit element, said coupling circuit comprising:

a die capacitor connecting said first circuit element to said second circuit element, said die capacitor having a first electrode facing to and being in contact with said first circuit element and a second electrode wire-bonded to said second circuit element; and

a chip capacitor connecting said first circuit element to said second circuit element, said chip capacitor having a first electrode in directly contact with said first circuit element and a second electrode in contact with said second electrode of said die capacitor.

2. The coupling circuit according to claim 1, wherein said first and second circuit elements are co-planar lines.

3. The coupling circuit according to claim 1, wherein said first circuit element is a c-planar line provided on a ceramic substrate and said second circuit element is an integrated circuit in bare chip shape.

4. The coupling circuit according to claim 3, wherein said substrate is enclosed in a metal package with said integrated circuit.

5. The coupling circuit according to claim 3, wherein said die capacitor is mounted on an edge of said co-planar line such that an edge of said die capacitor sticks out of said edge of said co-planar line.

6. The coupling circuit according to claim 5, further includes an insulating resin filled under said die capacitor.

7. The coupling circuit according to claim 3, wherein said die capacitor is mounted on an edge of said co-planar line such that an edge of said die capacitor sticks out of said edge of said co-planar line and said die-capacitor is tilting toward said second circuit element.

8. The coupling circuit according to claim 7, further includes an insulating resin filled under said die capacitor.

9. The coupling circuit according to claim 1, further includes an inductor connected to said second electrode of said die capacitor,

wherein said coupling circuit and said inductor comprises a bias-T circuit.