Sensor substrate and method of fabricating same
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Abstract
A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.
74 Citations
29 Claims
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1-14. -14. (Canceled)
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15. A method of forming an hermetically sealed substrate comprising:
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obtaining a substrate material;
forming a via from a first side of the substrate to a second side of the substrate; and
filling the via with a conductive material such that an hermetic seal forms between the first side of the substrate and the second side of the substrate. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29-30. -30. (Canceled)
Specification