Polishing apparatus
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Abstract
A polishing apparatus is used for polishing a substrate such as a semiconductor wafer, and has a sensor capable of continuously detecting the thickness of an electrically conductive layer. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding and pressing the substrate against the polishing surface to polish the surface of the substrate. A sensor such as an eddy-current sensor is disposed below the polishing surface of the polishing table for measuring the thickness of a conductive layer formed on the surface of the substrate.
37 Citations
12 Claims
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1-6. -6. (Cancel)
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7. A polishing apparatus comprising:
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a polishing table having a polishing surface;
a top ring for holding a substrate and pressing a surface of the substrate against said polishing surface to polish the surface of the substrate; and
an eddy-current sensor for measuring the thickness of a conductive layer formed on the surface of the substrate to produce a detected signal indicating a polishing uniformity of the surface of the substrate in a substantially diametrical direction of the substrate as said eddy-current sensor passes beneath the surface of the substrate along an arc. - View Dependent Claims (8, 9, 10, 11, 12)
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Specification