Methods and apparatus for sensor alignment
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Accused Products
Abstract
A method for attaching a sensor and a housing to opposite sides of a mounting substrate is provided. The sensor has a sensing face that includes a sensing area and at least one signal output contact thereon. The mounting substrate has a circuitry face and at least one signal input contact thereon. The mounting substrate also has an opening therethrough. The method includes positioning the sensing area over the opening so that the at least one signal output contact of the sensor makes contact with the at least one signal input contact of the mounting substrate. The mounting substrate receives the housing so that the housing and the sensor are in alignment.
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Citations
80 Claims
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1-38. -38 (Cancelled).
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39. A method of attaching a sensor and a housing to opposite sides of a mounting substrate, the sensor having a sensing face and comprising a sensing area and at least one signal output contact thereon, the mounting substrate having a circuitry face and at least one signal input contact thereon, the mounting substrate also having an opening therethrough, the method comprising:
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positioning the sensing area over the opening so that the at least one signal output contact of the sensor contacts the at least one signal input contact of the mounting substrate; and
positioning the housing in contact with the mounting substrate so that the housing and the sensor are in alignment. - View Dependent Claims (40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56)
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57. A method of attaching a sensor to a mounting substrate, the sensor having a sensing face comprising a sensing area and at least one signal output contact thereon, the mounting substrate having a circuitry face and at least one signal input contact thereon, the mounting substrate also having an opening therethrough, the method comprising:
positioning the sensing area over the opening so that the at least one signal output contact of the sensor contacts the at least one signal input contact of the mounting substrate. - View Dependent Claims (58, 59, 60, 61, 62, 63, 64, 65)
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66. A sensor package comprising:
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a mounting substrate having a circuitry face side and at least one signal input contact thereon, said mounting substrate also having an opening therethrough;
a sensor on the circuitry face side of said mounting substrate and having a sensing face comprising a sensing area and at least one signal output contact thereon, the sensing area being over the opening so that the at least one signal output contact contacts the at least one signal input contact of said mounting substrate; and
a housing on a back side of said mounting substrate opposite the circuitry face side and being aligned with said sensor. - View Dependent Claims (67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80)
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Specification