Light-emitting diode for large current driving

• US 20040227145A1
• Filed: 09/10/2003
• Published: 11/18/2004
• Est. Priority Date: 05/16/2003
• Status: Active Grant

• Current Assignee: Stanley Electric Company Limited
• Original Assignee: Stanley Electric Company Limited
• Inventors: Namioka, Kaori, Abe, Tomoaki
• Granted Patent: US 7,075,114 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/43 Manufacturing methods
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light-emitting diode for large current driving (1) is provided according to the invention. It comprises a metal substrate (4) having an upper surface and provided with an electrically insulated distribution circuit (4a) formed on the upper surface. A metal base (3) is directly attached to the metal substrate (4) and provided with an LED chip (2) mounted thereon. A gold wire (5) is arranged to connect the distribution circuit to the LED chip. A resin lens (6) is arranged to cover part of the metal base over the LED chip including at least the gold wire (5). Therefore, the metal base with the LED chip mounted thereon and the metal substrate can contact the atmosphere in a large area to dissipate heat efficiently. While keeping this construction, the LED chip can be wired with a small amount of heat through the distribution circuit separated from the metal substrate.

Claims

1. A light-emitting diode for large current driving, comprising:

a metal substrate provided with a distribution circuit formed on the surface thereof and electrically insulated therefrom;

a metal base directly attached to and thereby in thermally contact with said metal substrate, and provided with an LED chip mounted thereon;

a gold wire connecting said distribution circuit with said LED chip; and

a plastic lens attached over a surface of said metal substrate on which a surface said LED chip is mounted, said lens covering part of said metal base including at least said gold wire.

2. The light-emitting diode for large current driving according to claim 1, wherein a first through hole is formed in said metal substrate at least at one spot of which a location is corresponding to that of said plastic lens and said plastic lens is attached through said first through hole.

3. The light-emitting diode for large current driving according to claim 1, wherein said metal base is attached to said metal substrate by means of caulking or press fitting.

8. The light-emitting diode for large current driving according to claim 2, wherein said metal base is attached to said metal substrate by means of caulking or press fitting.

9. The light-emitting diode for large current driving according to claim 2, wherein said metal base is composed of copper.

10. The light-emitting diode for large current driving according to claim 3, wherein said metal base is composed of copper.

11. The light-emitting diode for large current driving according to claim 2, wherein said metal substrate is composed of copper or aluminum.

12. The light-emitting diode for large current driving according to claim 3, wherein said metal substrate is composed of copper or aluminum.

14. The light-emitting diode for large current driving according to claim 2, wherein a space is formed on a rear of said plastic lens and between said plastic lens and said metal substrate to contain said LED chip, said gold wire and part of said metal base, and is filled with a silicone resin.

15. The light-emitting diode for large current driving according to claim 3, wherein a space is formed on a rear of said plastic lens and between said plastic lens and said metal substrate to contain said LED chip, said gold wire and part of said metal base, and is filled with a silicone resin.

18. The light-emitting diode for large current driving according to claim 2, wherein:

said metal base is attached to said metal substrate by means of caulking or press fitting;

said metal base is composed of copper;

said metal substrate is composed of copper or aluminum;

a space is formed on a rear of said plastic lens and between said plastic lens and said metal substrate to contain said LED chip, said gold wire and part of said metal base, and is filled with a silicone resin.

19. The light-emitting diode for large current driving according to claim 18, wherein at least one through hole is formed at a location in said metal substrate which a location corresponds to that of said space, and said silicone fills said space through said through hole.

4. The light-emitting diode for large current driving according to claim, wherein said metal base is composed of copper.

13. The light-emitting diode for large current driving according to claim 4, wherein said metal substrate is composed of copper or aluminum.

16. The light-emitting diode for large current driving according to claim 4, wherein a space is formed on a rear of said plastic lens and between said plastic lens and said metal substrate to contain said LED chip, said gold wire and part of said metal base, and is filled with a silicone resin.

5. The light-emitting diode for large current driving according to claim, wherein said metal substrate is composed of copper or aluminum.

17. The light-emitting diode for large current driving according to claim 5, wherein a space is formed on a rear of said plastic lens and between said plastic lens and said metal substrate to contain said LED chip, said gold wire and part of said metal base, and is filled with a silicone resin.

6. The light-emitting diode for large current driving according to claim, wherein a space is formed on a rear of said plastic lens and between said plastic lens and said metal substrate to contain said LED chip, said gold wire and part of said metal base, and is filled with a silicone resin.

7. The light-emitting diode for large current driving according to claim 6, wherein at least one through hole is formed at a location in said metal substrate which a location corresponds to that of said space, and said silicone fills said space through said through hole.