Stereolithographic seal and support structure for semiconductor wafer

• US 20040229002A1
• Filed: 05/15/2003
• Published: 11/18/2004
• Est. Priority Date: 05/15/2003
• Status: Abandoned Application

• Current Assignee: 3D Systems, Inc. (3D Systems Corporation)
• Original Assignee: 3D Systems, Inc. (3D Systems Corporation)
• Inventors: Flaharty, Grant R., Davis, Stewart A.
• Application Number:
  US10/440,624
• Publication Number:
  US 20040229002A1
• Time in Patent Office: Days
• US Class Current: 428/64.1
• CPC Class Codes: G03F 7/70416 2.5D lithography
• CPC Class Codes: G03F 7/70783 Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
• CPC Class Codes: H01L 21/30604 Chemical etching
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: Y10T 428/21 Circular sheet or circular blank

Abstract

A support structure is applied directly to the first side of a semiconductor work piece or wafer by a stereolithographic process layer by layer completely about and extending inwardly of the periphery of the wafer, but external to the selected area within which a desired circuitry pattern is placed, the support structure being of a desired height and of a material resistive to an acid etch process effective to seal the circuitry pattern in the selected area from acid when the work piece is subjected to an acid etch on the opposing second side and about the periphery. The support structure further strengthens the work piece against flexural failure.

Claims

1. A semiconductor work piece having a substrate with a first side and an opposing second side, the first side having a desired circuitry pattern thereon within a selected area, the substrate having a periphery within which is the selected area, comprising:

a support structure applied directly to the first side by a stereolithographic process layer by layer completely about and extending inwardly of the periphery but external to the selected area, the support structure being of a desired height and of a material resistive to an acid etch process effective to seal the circuitry pattern in the selected area from acid when the work piece is subjected to an acid etch on the opposing second side and about the periphery, the support structure further strengthening the work piece against flexural failure.

2. The work piece according to claim 1 wherein the support structure is inset inwardly from the periphery.

3. The semiconductor work piece according to claim 1 wherein the support structure abuts the periphery.

4. The semiconductor work piece according to claim 1 wherein the desired height of the support structure is between about 0.060 to about 0.2 inches.

5. The semiconductor work piece according to claim 4 wherein the support structure has a thickness of about 0.1 to about 0.8 inches.

6. The semiconductor work piece according to claim 1 wherein the support structure is generally circular.

7. The semiconductor work piece according to claim 1 wherein the support structure is rectangular or square.

8. The semiconductor work piece according to claim 1 wherein the support structure is an acid resistant UV curable material having at least one polymerizing organic substance, at least one free-radical polymerizing organic substance, and at least one hydroxyl-functional aromatic compound.

9. The semiconductor work piece according to claim 1 wherein the circuitry pattern is applied via lithography.

10. The semiconductor work piece according to claim 1 wherein the support structure is removed after the acid etch.

11. The semiconductor work piece according to claim 1 wherein the semiconductor work piece further is contained in a fixture built stereolithographically in a coating system prior to placement of the semiconductor work piece within the system for creation of the support structure.

12. The semiconductor work piece according to claim 11 wherein the fixture conforms to the shape of the semiconductor work piece and has abutments spaced about the periphery of the semiconductor work piece to retain the semiconductor work piece.

13. The semiconductor work piece according to claim 11 wherein the coating system is a stereolithography system.

14. The semiconductor work piece according to claim 11 wherein the the coating system is an ink jet system.

15. A support fixture for receiving a semiconductor work piece and a semiconductor work piece having a substrate with a first side and an opposing second side, the first side having a desired circuitry pattern thereon within a selected area, the substrate having a periphery within which is the selected area, comprising in combination:

the work piece having a support structure applied directly to the first side by a stereolithographic process layer by layer completely about and extending inwardly of the substrate periphery but external to the selected area, the support structure being of a desired height and of a material resistive to an acid etch process effective to seal the circuitry pattern in the selected area from acid when the work piece is subjected to an acid etch on the opposing second side and about the periphery, the support structure further strengthening the work piece against flexural failure; and

the support fixture built stereolithographically in a coating system prior to placement of the semiconductor work piece within the system for creation of the support structure, the support fixture further conforming to the shape of the semiconductor work piece and having abutments positioned about the substrate periphery to retain the semiconductor work piece.