LED lamp manufacturing process

• US 20040229391A1
• Filed: 04/23/2004
• Published: 11/18/2004
• Est. Priority Date: 04/25/2003
• Status: Abandoned Application

• Current Assignee: Mitsubishi Gas Chemical Company Incorporated (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Gas Chemical Company Incorporated (Mitsubishi Electric Corporation)
• Inventors: Ohwada, Hisashi, Ohya, Kazuyuki, Sayama, Norio
• Application Number:
  US10/830,312
• Publication Number:
  US 20040229391A1
• Time in Patent Office: Days
• US Class Current: 438/26
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 2201/2054 Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/4602 characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Abstract

An LED lamp manufacturing process comprising manufacturing a multi-layer printed wiring board having a large number of LED lamp portions, each comprising a depressed portion whose side wall reflects light and has a mounted LED chip sealing resin container function and whose inner bottom has an LED chip mounting pattern, and a terminal pattern which is made conductive with the LED chip mounting pattern and formed on the outer under surface or outer side surface of the depressed portion, mounting predetermined LED chips on the LED chip mounting patterns, sealing the depressed portions with a resin and cutting the board into individual LED lamps, wherein the process comprises:

a) preparing a plated through hole printed wiring board (P) having LED chip mounting patterns and terminal patterns formed thereon;

b) preparing a through hole formed board (H) having through holes which correspond to the depressed portions and if necessary, have a treated wall to increase reflectance; and

c) aligning the through hole formed board (H) with the above plated through hole printed wiring board (P) and bonding them together.

According to the present invention, an LED lamp having a greatly increased LED chip mounting space can be manufactured and its assembly work can be simplified. Therefore, the manufacturing process of the present invention has a great industrial value.

Claims

1. An LED lamp manufacturing process comprising manufacturing a multi-layer printed wiring board having a large number of LED lamp portions, each comprising a depressed portion whose side wall reflects light and has a mounted LED chip sealing resin container function and whose inner bottom has an LED chip mounting pattern, and a terminal pattern which is made conductive with the LED chip mounting pattern and formed on the outer under surface or outer side surface of the depressed portion, mounting predetermined LED chips on the LED chip mounting patterns, sealing the depressed portions with a resin and cutting the board into individual LED lamps, wherein the process comprises:

a) preparing a plated through hole printed wiring board (P) having LED chip mounting patterns and terminal patterns formed thereon;

b) preparing a through hole formed board (H) having through holes which correspond to the depressed portions and if necessary, have a treated wall to increase reflectance; and

c) aligning the through hole formed board (H) with the above plated through hole printed wiring board (P) and bonding them together.

2. The LED lamp manufacturing process according to claim 1, wherein the plated through hole printed wiring board (P) has a heat conductivity of 30 W(mk)⁻

1 or more.

3. The LED lamp manufacturing process according to claim 1, wherein the plated through hole printed wring board (P) is formed from a double-side copper-clad resin-impregnated composite ceramic board.

4. The LED lamp manufacturing process according to claim 1, wherein bonding is carried out with a thermoplastic polyimide resin.

5. The LED lamp manufacturing process according to claim 1, wherein LED chips are mounted on each LED mounting pattern of the plated through hole printed wiring board (P), the through hole formed board (H) is aligned with and bonded to the plated through hole printed wiring board (P), the depressed portions are sealed with a resin, and the assembly is cut.

6. The LED lamp manufacturing process according to claim 1, wherein the short diameter of the through holes of the through hole formed board (H) is 0.8 mm or less.

7. The LED lamp manufacturing process according to claim 5, wherein some or all of the location marks of the LED chip mounting patterns formed on the plated through hole printed wiring board (P) overlap with the bonding portions of the through hole formed board (H).