Method for manufacturing microstructure
First Claim
1. A method for manufacturing a microstructure having a thin-walled portion with use of a material substrate having a laminated structure which comprises:
- a first conductor layer;
a second conductor layer;
a third conductor layer;
a first insulating layer which is patterned to have a first masking part for covering a thin-wall forming region of the second conductor layer, the first insulating layer being interposed between the first conductor layer and the second conductor layer; and
a second insulating layer which is patterned to have a second masking part for covering the thin-wall forming region of the second conductor layer, the second insulating layer being interposed between the second conductor layer and the third conductor layer;
wherein the method comprises forming the thin-walled portion in the second conductor portion by etching the material substrate from the first conductor layer down to the second insulating layer via a mask pattern including a non-masking region corresponding to the thin-wall forming region of the second conductor layer.
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Accused Products
Abstract
A method is for manufacturing a microstructure having a thin-walled portion with use of a material substrate. The material substrate has a laminated structure which includes a first conductor layer 101, a second conductor layer 102, a third conductor layer 103, a first insulating layer 104 interposed between the first conductor layer and the second conductor layer, and a second insulating layer 105 interposed between the second conductor layer and the third conductor layer. The first insulating layer is patterned to have a first masking part for covering a thin-wall forming region of the second conductor layer. The second insulating layer is patterned to have a second masking part for covering the thin-wall forming region of the second conductor layer. The method includes forming the thin-walled portion in the second conductor portion by etching the material substrate from the first conductor layer down to the second insulating layer via a mask pattern 58 including a non-masking region corresponding to the thin-wall forming region of the second conductor layer.
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Citations
16 Claims
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1. A method for manufacturing a microstructure having a thin-walled portion with use of a material substrate having a laminated structure which comprises:
- a first conductor layer;
a second conductor layer;
a third conductor layer;
a first insulating layer which is patterned to have a first masking part for covering a thin-wall forming region of the second conductor layer, the first insulating layer being interposed between the first conductor layer and the second conductor layer; and
a second insulating layer which is patterned to have a second masking part for covering the thin-wall forming region of the second conductor layer, the second insulating layer being interposed between the second conductor layer and the third conductor layer;
wherein the method comprises forming the thin-walled portion in the second conductor portion by etching the material substrate from the first conductor layer down to the second insulating layer via a mask pattern including a non-masking region corresponding to the thin-wall forming region of the second conductor layer. - View Dependent Claims (2)
- a first conductor layer;
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3. A method for manufacturing a microstructure having a thin-walled portion, comprising:
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a material substrate lamination step for preparing a material substrate having a laminated structure which comprises;
a first conductor layer;
a second conductor layer;
a third conductor layer;
a first insulating layer which is patterned to have a first masking part for covering a thin-wall forming region of the second conductor layer, the first insulating layer being interposed between the first conductor layer and the second conductor layer; and
a second insulating layer which is patterned to have a second masking part for covering the thin-wall forming region of the second conductor layer, the second insulating layer being interposed between the second conductor layer and the third conductor layer; and
a wall-thinning step for forming the thin-walled portion in the second conductor portion by etching the material substrate from the first conductor layer down to the second insulating layer via a mask pattern including a non-masking region corresponding to the thin-wall forming region of the second conductor layer. - View Dependent Claims (4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method for manufacturing a microstructure having a thin-walled portion with use of a material substrate having a laminated structure which comprises a first conductor layer, a second conductor layer, and a first insulating layer interposed between the first conductor layer and the second conductor layer;
- wherein the method comprises the steps of;
forming the thin-walled portion touching the first insulating layer by performing a first etching treatment with respect to the second conductor layer of the material substrate with use of a first mask pattern having a masking part covering a thin-wall forming region of the second conductor layer;
coating the thin-walled portion with an etching stop film;
laminating a third conductor layer on the second conductor layer to bury the thin-walled portion; and
performing a second etching treatment from the side of the third conductor layer down to the first insulating layer with use of a second mask pattern having a non-masking region corresponding to the thin-wall forming region.
- wherein the method comprises the steps of;
Specification