Light emitting device and manufacturing method of the same
First Claim
Patent Images
1. A light emitting device comprising:
- a substrate;
a light emitting element covered with a barrier film over the substrate;
a wiring connected portion over the substrate; and
a signal processing circuit over the substrate, wherein the signal processing circuit is formed with thin film transistor; and
wherein the wiring connected portion and at least a part of the signal processing circuit are located beside a same edge of the substrate.
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Abstract
The invention provides a downsized structure of a light emitting device, and a light emitting device which has enough reliability as a downsized light emitting device. The light emitting device comprising light emitting elements according to the invention includes a signal processing circuit disposed beside an FPC and the like that tended to be the dead space conventionally. Also, the light emitting device has a sealed structure using a barrier film in which moisture and oxygen can be blocked from outside not to come into TFTs, wirings, and the light emitting elements formed over a substrate.
64 Citations
12 Claims
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1. A light emitting device comprising:
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a substrate;
a light emitting element covered with a barrier film over the substrate;
a wiring connected portion over the substrate; and
a signal processing circuit over the substrate, wherein the signal processing circuit is formed with thin film transistor; and
wherein the wiring connected portion and at least a part of the signal processing circuit are located beside a same edge of the substrate. - View Dependent Claims (5, 10)
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2. A light emitting device comprising:
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a substrate;
a wiring connected portion over the substrate;
a signal processing circuit over the substrate;
a first barrier film over the substrate;
a thin film transistor forming layer formed over the first barrier film;
a second barrier film formed over the thin film transistor forming layer;
a wiring forming layer formed over the second barrier film;
a third barrier film formed over the wring forming layer;
a light emitting element forming layer formed over the third barrier film; and
a fourth barrier film formed over the light emitting element forming layer, wherein the second barrier film is in contact with the first barrier film in a first opening formed in a part of the thin film transistor forming layer;
wherein the signal processing circuit is formed with thin film transistor;
wherein the wiring connected portion and at least a part of the signal processing circuit are located beside a same edge of the substrate; and
wherein the signal processing circuit is formed in the exterior of an area in which the second barrier film is in contact with the first barrier film. - View Dependent Claims (3, 4, 6, 11)
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7. A light emitting device comprising:
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a substrate;
a wiring connected portion over the substrate;
a signal processing circuit over the substrate;
a first barrier film over the substrate;
a thin film transistor forming layer formed over the first barrier film;
a second barrier film formed over the thin film transistor forming layer;
a wiring forming layer formed over the second barrier film;
a third barrier film formed over the wring forming layer;
an light emitting element forming layer formed over the third barrier film; and
a fourth barrier film formed over the light emitting element forming layer, wherein the thin film transistor forming layer is covered with the first barrier film and the second barrier film;
wherein the signal processing circuit is formed with thin film transistor;
wherein the wiring connected portion and at least a part of the signal processing circuit are located beside a same edge of the substrate; and
wherein the signal processing circuit is formed in the exterior of the area in which the second barrier film is in contact with the first barrier film over the substrate. - View Dependent Claims (8, 9, 12)
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Specification