Die package for connection to a substrate

• US 20040232447A1
• Filed: 06/29/2004
• Published: 11/25/2004
• Est. Priority Date: 10/18/2000
• Status: Active Grant

• Current Assignee: IQLP, LLC
• Original Assignee: Silicon Bandwidth Incorporated (Interplex Holdings Pte. Ltd.)
• Inventors: Crane, Stanford W. Jr., Ogata, Charley Takeshi, Jeon, Myoung-Soo
• Granted Patent: US 7,253,365 B2
• Time in Patent Office: Days
• US Class Current: 257/202
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A die carrier for holding a die, such as a microdisplay die, may be electrically connected to a substrate by pressing the substrate against flexible, resilient leads of the die carrier. The package includes a housing and a shroud mounted to the housing. The substrate is inserted through a slot in the shroud and, within the shroud, engages against the flexible, resilient leads, thereby establishing an electrical contact.

Claims

1. A die package comprising:

a housing for holding a microelectronic die;

a plurality of electrically conductive leads held in said housing, each of said leads including a flexible, external portion projecting externally from said housing; and

a shroud attached to said housing over said leads, said shroud having a slot for receiving a substrate such that, when the substrate is received in said slot, the external portions of said leads flexibly contact the substrate to form an electrical connection between said plurality of leads and the substrate.

2. A die package according to claim 1, wherein said electrically conductive leads are held in said housing in two vertically-spaced rows.

3. A die package according to claim 1, wherein said microelectronic die is a microdisplay die housed in said housing, said microdisplay die being electrically coupled to an interior portion of said electrically conductive leads disposed within said housing.

4. A die package according to claim 1, wherein said leads are mechanically held in a sidewall of said housing.

5. A die package according to claim 4, wherein said slot is disposed to receive the substrate such that an edge of the substrate received in said slot faces a sidewall of said housing.

6. A die package according to claim 1, wherein each said external lead portion includes a contact portion for establishing an electrical contact to the substrate.

7. A die package according to claim 6, wherein said shroud further includes an opening transverse to said slot and opposite said contact portions of said leads, wherein when the substrate is received in said slot, the substrate is held between said contact portions and said opening.

8. A die package according to claim 6, wherein said slot intersects said contact portions of said leads.

9. A die package according to claim 8, wherein each said contact portion includes an angled surface facing an opening of said slot which first receives the substrate, wherein the angled surface angles away from the opening so that, when the substrate is received in said slot, an edge of the substrate abuts the angled surface, flexes the external portion of said lead away from said slot, and slides past said angled surface.

10. A die package according to claim 1, wherein said shroud is detachable from said housing.

11. A die package according to claim 1, wherein said housing includes a plurality of arms for receiving said shroud, said arms extending from a sidewall of said housing.

12. A die package according to claim 11, wherein each of said arms include a groove, and said shroud includes tongues for insertion into said grooves.

13. A die package according to claim 1, wherein the substrate comprises a printed circuit board.

14. A die package according to claim 1, wherein the substrate comprises a flexible circuit board.

15. A die package according to claim 1, wherein said housing holds a plurality of microelectronic dies.

16. A die package according to claim 1, wherein the microelectronic die is a light-producing display die.

17. A die package according to claim 1, wherein the microelectronic die is a data collection device die that collects data based on light sensitivity.

18. A microdisplay comprising:

a microdisplay die; and

a die package for holding said microdisplay die, said die packaging including a housing, a plurality of electrically conductive leads held in said housing, each of said leads including a flexible, external portion projecting externally from said housing, and a shroud attached to said housing over said leads, said shroud having a slot for receiving a substrate such that, when the substrate is received in said slot, the external portions of said leads flexibly contact the substrate to form an electrical connection between said plurality of leads and the substrate.

19. A microdisplay according to claim 18, wherein said electrically conductive leads are held in said housing in two vertically-spaced rows.

20. A microdisplay according to claim 18, wherein said leads are mechanically held in a sidewall of said housing.

21. A microdisplay according to claim 18, wherein:

each said external lead portion includes a contact portion for establishing an electrical contact to the substrate, and

said shroud further includes an opening transverse to said slot and opposite said contact portions of said leads such that, when the substrate is received in said slot, the substrate is held between said contact portions and said opening.

22. A microdisplay according to claim 18, wherein said shroud is detachable from said housing.

23. A microdisplay according to claim 18, wherein the substrate comprises a flexible circuit board.

24. A method for securing a substrate to a die package including a package housing, a plurality of resilient, electrically-conductive leads extending from said housing, and a shroud attached to said housing over said leads, said shroud having a slot for receiving the substrate, said method comprising:

inserting the substrate into said slot such that an edge of the substrate abuts contact portions of said leads and causes said leads to flex to allow the edge of the substrate to pass the contact portions of said leads, and

further inserting the substrate into said slot so that the contact portions flexibly engage electrically-conductive contact regions on a surface of the substrate adjacent to the edge, thereby forming an electrical connection between said plurality of leads and the substrate.

25. A method of securing a substrate to a die package according to claim 24, wherein said substrate is a printed circuit board.

26. A method of securing a substrate to a die package according to claim 25, wherein said substrate is a flexible circuit board.

27. A method of securing a substrate to a die package according to claim 25, wherein said die package comprises a microdisplay die package housing a microdisplay die.

28. A method of securing a substrate to a die package according to claim 25, wherein said package housing holds a plurality of microelectronic dies.

29. A method of securing a substrate to a die package according to claim 25, wherein said package housing hold a light-producing display die.

30. A method of securing a substrate to a die package according to claim 25, wherein the package housing holds a data collection device die that collects data based on light sensitivity.