Sensor arrangement,in particular a micro-mechanical sensor arrangement
3 Assignments
0 Petitions
Accused Products
Abstract
A sensor array, in particular a micromechanical sensor array, and methods for manufacturing the sensor array are provided, which sensor array includes a sensor section for supplying certain sensor signals, and a cover section provided on the sensor section to form a hermetically sealed sensor interior. An electronic analyzer device is at least partially integratable into cover section for analysis of the sensor signals, and electrically connectable to a corresponding circuit device of the sensor section.
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Citations
39 Claims
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1-22. -22. (canceled)
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23. A sensor array, comprising:
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a sensor section for supplying sensor signals, the sensor section having a circuit device;
a cover section provided as a thin-layer section on the sensor section to form a hermetically sealed sensor interior defined between the cover section and the sensor section; and
an electronic analyzer device, wherein at least a portion of the electronic analyzer device is integrated into the cover section for analysis of the sensor signals, and wherein the electronic analyzer device is electrically connected to the circuit device of the sensor section. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31)
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32. A method for manufacturing a sensor array, comprising:
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providing a structured sensor section having a circuit device;
applying an insulation layer to the sensor section;
providing through connections in the insulation layer;
applying a cover section layer to the insulation layer;
removing the insulation layer;
providing a hermetically sealed sensor interior between the sensor section and the cover section layer; and
integrating at least a portion of an electronic analyzer device into the cover section layer, wherein the electronic analyzer device is connected via the through connections to the circuit device of the sensor section. - View Dependent Claims (33, 34, 35, 36, 37, 38, 39)
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Specification