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Carrier with metal bumps for semiconductor die packages

  • US 20040232542A1
  • Filed: 03/11/2004
  • Published: 11/25/2004
  • Est. Priority Date: 05/14/2001
  • Status: Active Grant
First Claim
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1. A carrier for a semiconductor die package, the carrier comprising:

  • (a) a metal layer; and

    (b) a plurality of bumps formed in the metal layer, wherein the carrier is for electrically coupling a semiconductor die to a circuit substrate.

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  • 6 Assignments
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