RF front-end module for wireless communication devices
First Claim
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1. A device, comprising:
- an active substrate comprising substantially transistors or diodes formed thereon, the active substrate having at least a radio frequency amplifier or a switch formed thereon;
a passive substrate comprising substantially inductors, capacitors or resistors formed thereon;
a plurality of bonding pads positioned on the active and passive substrates; and
bonding wires connected to the bonding pads.
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Abstract
Systems and methods are disclosed for a device with an active substrate comprising substantially transistors or diodes formed thereon, the active substrate having at least a power amplifier formed thereon; a passive substrate comprising substantially inductors, capacitors or resistors formed thereon; a plurality of bonding pads positioned on the active and passive substrates; and bonding wires connected to the bonding pads.
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Citations
28 Claims
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1. A device, comprising:
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an active substrate comprising substantially transistors or diodes formed thereon, the active substrate having at least a radio frequency amplifier or a switch formed thereon;
a passive substrate comprising substantially inductors, capacitors or resistors formed thereon;
a plurality of bonding pads positioned on the active and passive substrates; and
bonding wires connected to the bonding pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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Specification