Low cost antennas using conductive plastics or conductive composites

• US 20040233112A1
• Filed: 06/25/2004
• Published: 11/25/2004
• Est. Priority Date: 02/15/2001
• Status: Abandoned Application

• Current Assignee: Integral Technologies, Inc.
• Original Assignee: Integral Technologies, Inc.
• Inventors: Aisenbrey, Thomas
• Application Number:
  US10/877,092
• Publication Number:
  US 20040233112A1
• Time in Patent Office: Days
• US Class Current: 343/700MS
• CPC Class Codes: B29C 45/0001 characterised by the choice of material
• CPC Class Codes: B29C 45/0013 using fillers dispersed in the moulding material, e.g. metal particles
• CPC Class Codes: B29K 2995/0005 Conductive
• CPC Class Codes: B29L 2031/3456 Antennas, e.g. radomes
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01Q 1/1271 for mounting on windscreens
• CPC Class Codes: H01Q 1/36 Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H01Q 9/16 with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole H01Q9/44 takes precedence
• CPC Class Codes: H01Q 9/30 with feed to end of elongated active element, e.g. unipole H01Q9/44 takes precedence
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2201/0281 Conductive fibers
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2203/0113 Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
• CPC Class Codes: H05K 3/101 by casting or moulding of conductive material
• CPC Class Codes: H05K 3/107 by filling grooves in the support with conductive material H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence

Abstract

Low cost antennas formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises conductor fibers or conductor particles in a resin or plastic host wherein the ratio of the weight of the conductor fibers or conductor particles to the weight of the resin or plastic host is between about 0.20 and 0.40. The conductive fibers can be stainless steel, nickel, copper, silver, or the like. The antenna elements can be formed using methods such as injection molding or extrusion. Virtually any antenna fabricated by conventional means such as wire, strip-line, printed circuit boards, or the like can be fabricated using the conductive loaded resin-based materials. The conductive loaded resin-based material used to form the antenna elements can be in the form of a thin flexible woven fabric which can readily cut to the desired shape.

Claims

1. An antenna comprising:

a number of antenna elements formed of a conductive loaded resin-based material, wherein said conductive loaded resin-based material comprises conductor fibers in a resin or plastic host and the ratio of the weight of said conductor fibers to the weight of said resin or plastic host is between about 0.20 and 0.40; and

electrical communication to and among said antenna elements.

2-30. -30. (CANCELLED)

31. A conductive composite, comprising:

a base resin host; and

micron conductor particles in said base resin host wherein the ratio of the weight of said micron conductor particles to the weight of said base resin host is between about 0.20 and 0.40, thereby forming a conductive loaded resin-based material.

32. The conductive composite of claim 31 wherein said micron conductor particles have generally spherical shapes and diameters of between about 3 and 11 microns.

33. The conductive composite of claim 31 wherein said micron conductor particles are stainless steel, nickel, copper, or silver.

34. The conductive composite of claim 31 wherein said base resin host is a polymer resin.

35. The conductive composite of claim 31 wherein said conductive loaded resin-based material has a resistivity of between about 5 and 25 ohms per square.

36. The conductive composite of claim 31 wherein said conductive loaded resin-based material can be used to fabricate antennas.

37. The conductive composite of claim 31 wherein said conductive loaded resin-based material can be used to fabricate ground planes.

38. The conductive composite of claim 31 wherein said conductive loaded resin-based material can be molded or extruded to form desired shapes.

39. The conductive composite of claim 31 wherein said conductive loaded resin-based material can be cut or milled to form desired shapes.

40. The conductive composite of claim 31 wherein said conductive loaded resin-based material can be formed into fibers which can be woven or webbed into a conductive fabric.

41. A conductive composite, comprising:

a base resin host; and

micron conductor fibers in said base resin host wherein the ratio of the weight of said micron conductor fibers to the weight of said base resin host is between about 0.20 and 0.40, thereby forming a conductive loaded resin-based material.

42. The conductive composite of claim 41 wherein said micron conductor fibers have diameters of between about 3 and 11 microns.

43. The conductive composite of claim 41 wherein said micron conductor fibers have lengths of between about 5 and 10 millimeters.

44. The conductive composite of claim 41 wherein said micron conductor fibers are stainless steel, nickel, copper, silver, or nickel plated carbon.

45. The conductive composite of claim 41 wherein said base resin host is a polymer resin.

46. The conductive composite of claim 41 wherein said conductive loaded resin-based material has a resistivity of between about 5 and 25 ohms per square.

47. The conductive composite of claim 41 wherein said conductive loaded resin-based material can be used to fabricate antennas.

48. The conductive composite of claim 41 wherein said conductive loaded resin-based material can be used to fabricate ground planes.

49. The conductive composite of claim 41 wherein said conductive loaded resin-based material can be molded or extruded to form desired shapes.

50. The conductive composite of claim 41 wherein said conductive loaded resin-based material can be cut or milled to form desired shapes.

51. The conductive composite of claim 41 wherein said conductive loaded resin-based material can be formed into fibers which can be woven or webbed into a conductive fabric.